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ABOUT US

Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

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MARKET
AI Edge (20201005)
AI AND EDGE COMPUTING
The simulation of human intelligence processes by machines, especially computer systems. Specific applications of AI include expert systems, natural language processing (NLP), speech recognition and machine vision.
commun
COMMUNICATION
Connected to the Future.  From Gbps Ethernet to 5G, GOWIN offers full product portfolio of low power, high-speed interface and small footprint FPGA to meet communication equipment makers’ demand on time-to-market and reduce total...
industry
INDUSTRIAL
Smart, Connected and Green! Industry 4.0 requires machines to be intelligent, connected and energy saving.  Our low power, embedded DDR/SDRAM and high performance DSP , GOWIN FPGA enables industrial manufacturers from industrial...
auto
AUTOMOTIVE
Intelligent, Connected and Safe! Smart and safe driving are today automotive market trends and Advanced Driving Assistance System (ADAS) requires more sensors to be connected in car. GOWIN FPGA provides high IO counts in small form factor...
consumer
CONSUMER
Accelerate your Innovation.  Product differentiation and time-to-market are the critical success factors in today high competitive consumer marketplace.  GOWIN’s low cost, high performance FPGA with our on-the-shelf IP solutions is the answer...
medical
MEDICAL
Visual, Portable and Reliable. The semiconductor contents continue to increase in medical devices and systems as the emerging technology of MEMS and sensor.  Higher resolution of image sensor drives increased resolution, larger size and...
LED DISPLAY
cloud
CLOUD COMPUTING AND DATA CENTERS
High Performance and Programmability. The emerging cloud computing market drives higher performance and programmability of computing and storage devices in data center everyday. With abundant logic and DSP resources, GOWIN AroraTM ...
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NEWS
USB-01
2021-05-14
GOWIN Releases USB 2.0 PHY and Device Controller IP for Their FPGA Products
  SAN JOSE, Calif. and GUANGZHOU, China, May 17, 2021 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their USB 2.0 Interfacing Solution, allowing GOWIN FPGA designers to easily integrate USB 2.0 connectivity without the need for additional silicon devices.  GOWIN’s solution extends its broad support for USB connectivity over a large range of consumer, automotive, industrial, and communication applications.   According to BusinessWire, a Berkshire Hathaway Company, the market for USB devices has grown to over 30B USD making it one of the most widely used electrical interface standards in the world.  FPGA’s are known for high-speed IO interface flexibility as well as their ability to pipeline data processing with arithmetic logic elements.  However, no FPGA company to date has been able to cost-effectively interface an FPGA directly to USB 2.0 due to its data rate, clock recovery, and IO requirements.  As a result, product manufacturers have been limited to custom ASICs, feature limited microcontrollers, or expensive SoCs in order to enable USB 2.0 support.   “Getting data into and out of our FPGA products effortlessly is one of the most critical architectural considerations our customers encounter,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.  “Built-in USB 2.0 support for our devices is an essential step to enable new product innovations as well as provide a stable path for BOM cost reduction, multi-component integration, and end of life component replacement.”   The new GOWIN USB 2.0 interfacing solution eliminates the need for external PHYs, which were previously required to achieve USB HS (high speed) 480Mbps data rates.  Popular applications include bridging to other peripherals such as JTAG, SPI, and I2S, communicating with MIPI CSI-2 cameras and DSI displays, developing USB hubs, data traffic monitors and recorders, Bluetooth LE, and security dongles.   “We are excited to be the first to bring this long-awaited interconnect capability to the market,” said Scott Casper, Director of Sales, Americas, GOWIN Semiconductor,” FPGA design engineers and embedded system architects can now easily create their bridging solutions with our programmable FPGA products without worrying about limitations of off the shelf products and supply chain constraints.”   GOWIN Semiconductor has been pathing the way for innovative new FPGA products for several years now and the release of their USB 2.0 interfacing solution is the latest edition to this success. The solution includes a USB v2.0 soft PHY as well as a USB v2.0 Device Controller IP, which are included in GOWIN’s EDA Software’s IP Core Generator.  The USB 2.0 IPs are available free of charge with all GOWIN FPGA products.  A reference design, as well as development boards, are available, which instantiate the USB 2.0 IP cores along with a USB 2.0 to UART bridging example to get started.  The IP cores support almost all GOWIN FPGAs and provide a line rate of 480Mbps in High-Speed mode per the USB 2.0 specification.   “This latest release of a soft USB2.0 PHY from GOWIN continues to provide added value for customers in the low and mid-density FPGA space,” said Mike Furnival, Vice President of International Sales. “We are proud that GOWIN is committed to providing some of the most innovative and creative solutions while continuing to support some of the lowest costs and best availabilities in the industry”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2021 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com  
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Embedded World 2021
2021-02-26
GOWIN Semiconductor to attend Embedded World 2021 Digital
  London, UK and Guangzhou, China 26th February 2021. GOWIN Semiconductor Corporation, the world’s fastest growing FPGA provider, is delighted to announce that it is participating in Embedded World 2021 Digital during 1-5 March. Following on from our highly successful first time attendance in February 2020, GOWIN is joining an impressive list of industry participants who are taking advantage of ew21 digital’s highly developed digital platform to showcase our latest products and solutions to the embedded marketplace.   Embedded World, held annually in Germany, remains Europe’s predominant trade show for all embedded solutions and technologies. This year, without the ability to a host a person-to-person event the organising body at the Nurnberg Messe has done a tremendous job to pull together what we all believe will be a valuable contribution to the industry and an excellent opportunity for vendors, partners, and customer to get together, albeit virtually. Additionally, as a virtual event, the show in now more open a global audience allowing interested parties from all over the planet to benefit from this word class event   This year GOWIN will be showcasing and demonstrating its leading FPGA solutions including the latest developments to our world class GoAI 2.0 machine learning solution for edge inference, along with advanced solutions for FOC motor control, MIPI, USB and wireless/Bluetooth interfacing, ARM based SoC solutions and automotive all of which are based on GOWIN’s highly integrated, lowest power and lowest cost FPGA devices. Additionally, at the concurrent Embedded World conference, GOWIN’s Director of International Marketing, Grant Jennings, will conducting a class on “Developing Artificial Intelligence Using Machine Learning at the Edge with Embedded uSoC FPGAs” on Thursday 4th March at 13.30 CET.   “Given the obvious challenges posed by the global pandemic we are very pleased to be able to participate in this exciting virtual event Embedded World 21” said Mike Furnival, Director of Sales and General Manager of GOWIN Semiconductor in Europe. “It’s a testament to the continued progress we have made during the past year in terms of differentiated FPGA solutions and whilst we remain as the lowest cost provider of low and mid density FPGA devices, we have now emerged as one the most innovative in terms of advanced solutions in the marketplace, adding significant value to our customers and partners.”   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
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Automotive grade
2021-01-27
GOWIN Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability
  SAN JOSE, Calif. and GUANGZHOU, China, January 25, 2021 - GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, is pleased to announce the release of its new Automotive Grade FPGAs, targeting applications for telematics, infotainment, and the powertrain. AEC-Q100 has been in place for over 20 years defining the reliability qualification requirements for Automotive integrated circuits.  To get a certificate meeting the AEC-Q100 Grade 2 requirements, a manufacturer is required to submit a product to extreme environmental challenges.  GOWIN has submitted and passed all the requirements for their following devices:  GW1N-LV4QN88A4, GW2A-LV18QN88A6, GW2A-LV18PG256A6.  In addition, GOWIN’s Ultra Low Power GW1NZ-LV1QN48A4 will complete AEC-Q100 qualification in Q3’2021.   GOWIN’s success with mainstream FPGAs is now extended to its Automotive Grade products.  Active implementations with these low cost, small size devices include 360-degree surround view, smart cockpit, and vehicle control system.    “We are pleased to bring our low cost, small size, and low power FPGA products to the automotive segment,” said Scott Casper, Director of Sales, GOWIN Semiconductor.  “We continue to increase our presence in expanding marketplaces offering easy to use solutions for embedded system designers.”   For more information about GOWIN’s Automotive Grade products or any of their low-power, small size, low-cost FGPA devices, please visit www.gowinsemi.com.   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com  
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