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ABOUT US

Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

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NEWS
GoAI Poster (20200827) for Korea
2020-09-21
GOWIN Semiconductor Launches GoAI 2.0 for Embedded Machine Learning Inference
  SAN JOSE, Calif. and GUANGZHOU, China, September 21, 2020 - GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, releases the latest version of their GoAI machine learning platform, providing an SDK and accelerator to perform machine learning for edge inference using convolutional neural networks on GOWIN FPGAs.  GOWIN GoAI 2.0 offers direct integration into the TensorFlow and TensorFlow Lite Machine Learning Platforms, optimization for targeting GOWIN’s GW1NSR4P µSoC FPGA, and an accelerator to offload compute-intensive functions from the microcontroller embedded within GOWIN FPGAs with additional 80x performance.   Machine Learning is a rapidly developing field and development is aligning on frameworks, platforms, models, and datasets for better standardization, reliability, and ease of development.  TensorFlow has become one of these aligning platforms and has included support for embedded SoC’s and microcontrollers.  GoAI 2.0 adds the necessary additions to easily use TensorFlow with embedded FPGAs from GOWIN.   “GoAI 2.0 has several important updates for deploying machine learning models onto edge focused, embedded FPGAs,”  said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.  “We can use GoAI 2.0 to deploy reasonably sized and standardized machine learning models such as Mobilenet onto our GW1NSR4P µSoC FPGA.  The GW1NSR4P is perfect for performing TinyML inference at the edge using TensorFlow Lite for Microcontrollers because it includes a hardened ARM Cortex-M3 microcontroller for direct model porting and control of the GoAI accelerator, 4.6K look-up tables of FPGA fabric to instantiate the GoAI 2.0 accelerator and connect sensor inputs as well as an additional 8MB of SRAM for layer storage all in a low cost 6x6mm QFN48 package.  Our GoAI 2.0 SDK allows our customers to go from TensorFlow to FPGA deployment quickly and easily.”   With GoAI 2.0 no FPGA RTL or microprocessor C/C++ programming is required.  The C/C++ code to drive the accelerator from the ARM Cortex-M processor is generated automatically by the GoAI 2.0 SDK.  The GoAI 2.0 accelerator is offered as an FPGA IP, but is also included as part of pre-generated FPGA bitstreams with various types of sensor inputs.  The GoAI 2.0 accelerator architecture is designed such that only a register map needs to be updated per model layer by the processor and no RTL changes are required to deploy or change the machine learning model used.   While machine learning can have a significant learning curve, GoAI 2.0 offers several starting reference designs with different types of sensor inputs to get started such as cameras, microphones, and accelerometers.  Reference designs include data inference of predicting a sine wave output based on an input value, audio phrase detection for inferring a phrase of “yes” or “no” from a microphone input, and person detection inferring the presence of a human in view of a camera.  Additional reference designs are continuing to be developed including gesture detection which detects the shape a user draws in the air while holding the development board using an accelerometer.  Developers can get started with GoAI 2.0 using one of three GoAI Embedded Development Kits.  The development kits include various sizes of GOWIN FPGAs, sensors to run the reference designs, and other peripherals such as HDMI inputs and outputs for video demonstrations. “Machine Learning edge inference has become mainstream for applications in many marketplaces, including consumer, industrial, and medical,” said Scott Casper, Americas Director of Sales, GOWIN Semiconductor. “The GoAI 2.0 platform enables embedded system engineers to add these advanced features easily into applications at cost-effective prices.  We have many resources available such as reference platforms, development kits, and field support to get engineers started right away”   For more information on GOWIN’s GoAI 2.0 Machine Learning Platform and upcoming webinar, please visit us at https://www.gowinsemi.com/en/market/featured_detail/11/   “Gowin will demonstrate our GoAI 2.0 platform in the coming AI EXPO KOREA,” said by Stanley Tse, Sales Director (Asia) of Gowin Semiconductor Corp and General Manager of Gowin Semiconductor Hong Kong, “ We select AI EXPO KOREA as the first tradeshow to introduce GoAI 2.0 platform for the innovation and leading AI technology in Korea. Gowin GoAI 2.0 provides the most cost effective platform to the edge AI market and our person detection solution has already been selected by Korea customer as next generation platform. Our platform significantly reduces the power consumption and design complexity compared to their current solution.” GOWIN’s GoAI 2.0 solution will be demonstrated at AI EXPO KOREA on October 27-29, 2020 in Hall D, COEX, SEOUL, KOREA. Interested attendees can review the conference details at http://www.aiexpo.co.kr/main   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com  
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mipi con 2020 _工作區域 1
2020-08-31
GOWIN SEMICONDUCTOR To Present Using Bluetooth Low Energy with MIPI standards at MIPI DevCon 2020
  San Jose, Calif., August 31, 2020 – GOWIN Semiconductor Corp., the world’s fastest growing programmable logic company, will present on how to enable sensors integrated with MIPI standards with Bluetooth LE wireless connectivity on September 23rd 2020 from 7:35-8:05am PDT. MIPI DevCon is an annual event that connects developers with training and education related to MIPI standardization for mobile technologies. The two day event features sessions on key specifications, application examples and use cases in mobile influenced areas such as 5G, automotive, IoT and more. Interested attendees can review the conference details at https://www.mipi.org/devcon/2020 This year GOWIN Semiconductor will present on how MIPI interface standards are being actively integrated new types of mobile IoT products using programmable logic SoCs and Bluetooth Low Energy. https://www.mipi.org/devcon/2020/agenda/mipi-bluetooth-le-leveraging-mobile-technology-wireless-iot-applications MIPI specifications in smartphones have drastically reduced the cost and power of sensors, which has opened opportunities for unique and innovative products in other markets. However, new interfaces and use cases often suffer from initial disconnects in interface support from SoC and microcontrollers. FPGA’s have been used to bridge connectivity gaps between new and old interface standards, but have traditionally lacked other key technologies such as wireless to make them useful as a standalone SoC. Now, new IC’s are being developed which combine the capabilities of microcontrollers, FPGA’s and wireless transceivers at compelling cost, power and size metrics. “New interface adoption is traditionally a long process in the semiconductor industry as IC vendors align on when to integrate new and updated specifications into their next devices,” said Grant Jennings, Director of International Marketing of Gowin Semiconductor Corp. “FPGA’s have traditionally been used to convert between old and new specification standards due to their flexibility, but have often lacked other IP to be used as a standalone SoC. Now, new programmable SoC’s are providing ‘all-in-one’ devices containing Bluetooth Low Energy (LE) transceivers, microprocessors and FPGA fabric in a single chip.”GOWIN Semiconductor’s presentation at MIPI DevCon 2020 will feature use case examples in the wireless IoT space found while helping customers develop applications on the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.   About GOWIN Semiconductor Corp.Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.comCopyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com  
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AI EXPO KOREA (20200901)
2020-08-24
GOWIN SEMICONDUCTOR To ATTEND AI EXPO KOREA
      Guangzhou, Hong Kong, China, San Jose, Calif., 24 August, 2020 – GOWIN Semiconductor Corp., the world’s fastest growing programmable logic company, will attend AI EXPO KOREA on 27-29 Oct 2020 to demonstrate GOWIN latest GoAI solution at Hall D, COEX, SEOUL, KOREA.   AI EXPO KOREA is the only Artificial Intelligence Expo to meet the future artificial intelligence technology, new trends, new products and the best chance to meet all of Artificial Intelligence that leads the 4th Industrial Revolution. Interested attendees can review the conference details at http://www.aiexpo.co.kr/main   “We choose AI EXPO Korea as the first tradeshow to introduce Gowin GoAI solution for the innovation and leading AI technology of Korea ,” said by Stanley Tse, Sales Director (Asia) of Gowin Semiconductor Corp and General Manager of Gowin Semiconductor Hong Kong, “ Korea is one of the earliest countries to deploy 5G infrastructure worldwide which enables Edge AI market; Gowin GoAI also enables Edge AI application by using Machine Learning Accelerator provided over 80x of performance improvement compared standalone MCU’s; We already have customers in Korea on our GoAI Early Access Program and kick off project with our GW1NS-4C family.”   “We’re excited to show our latest GoAI platform, which makes it easy to deploy machine learning models onto GOWIN FPGAs,” Grant Jennings said, Director of International Marketing for GOWIN Semiconductor Corp.  “Customers can now easily train models in common and open machine learning frameworks such as Tensorflow and then automatically compile and deploy trained models for edge inference.”   In AI EXPO Korea, Gowin will demonstrate the objects detection, audio phases detection and gesture/movement detection solutions based on Gowin GoAI technology. Gowin GoAI provides an embedded artificial intelligence solution for loading trained machine learning models into GOWIN FPGA devices.     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com    
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