GOWIN Is Offering the Andes A25 RISC-V CPU IP and AE350 Subsystem As Instantiated Hard Cores in Its GW5AST-138 FPGA   [San Jose, Aug. 29, 2023] - Andes Technology Corporation (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, is thrilled to announce that its AndesCore™ A25 RISC-V CPU IP and AE350 peripheral subsystem is hardened and embedded in the GW5AST-138 FPGA chip from GOWIN Semiconductor, the world’s fastest growing FPGA company. This integration, one of the first complete RISC-V microcontrollers in an FPGA, provides designers the A25 processor power and the peripherals most processors require without consuming any FPGA resources. Thus, the hardware team can populate the FPGA with their value-added design while the software team can concurrently create application code based on the rich RISC-V ecosystem.   “Andes is committed to delivering cutting-edge RISC-V technologies allowing developers to create innovative and efficient solutions. The integration of the A25 RISC-V CPU and AE350 peripheral subsystem as a hard core in GOWIN Semiconductor’s GW5AST-138 FPGA marks a significant milestone in achieving this vision,” said Andes North America VP of Sales, Vivien Lin.  “This represents a significant milestone for the RISC-V architecture as it provides our joint customers a versatile hardware development platform to create, debug, and verify their ultimate SoC design before committing their netlist for silicon fabrication. For customers not requiring an SoC, it will enable a complete RISC-V computer ready to drive their end applications.”   "In the Arora V family, we incorporate the peripherals that a RISC-V CPU typically requires in hard instantiations," says GOWIN’s Sr. Director of Solution Development, Jim Gao. “We included a fully controllable high-speed SerDes for communication, video aggregation, and AI computing acceleration applications that demand very high data rates. Other instantiated functions include Block RAM modules supporting ECC error correction, high-performance multiple voltage GPIO, and high accuracy clock architecture. These hard functions save the FPGA programmable fabric of up 138K LUT’s for the designers’ unique logic implementation."     About the RISC-V Based GW5AST-138 FPGA:   The AndesCore™ A25 hard core, running at 400MHz, supports the RISC-V P-extension DSP/SIMD ISA (draft), single- and double-precision floating point and bit-manipulation instructions, and MMU for Linux based applications. The AE350 AXI/AHB-based platform comes with level-one memories, interrupt controller, debug module, AXI and AHB Bus Matrix Controller, AXI-to-AHB Bridge and a collection of fundamental AHB/APB bus IP components pre-integrated together as a system design. DDR3 controller and SPI-Flash controller in the FPGA fabric back up the A25's 32KByte I-Cache and D-Cache after cache misses. Off chip DDR3 provides data memory, SPI-Flash contains the A25's instruction memory (codes copied from SPI-Flash into DDR3 and Cache upon boot-up).  Besides hard instantiated functions, the GOWIN GW5AST-138 FPGA fabric affords 138K LUTs for custom design implementation.  GOWIN EDA provides an easy-to-use FPGA hardware development environment for the Arora V.  The environment supports multiple RTL-based programming languages, synthesis, placement and routing, bitstream generation and download, power analysis and in-device logic analyzer.   Price & Availability   The GW5AST-138 FPGA with SDK with GOWIN_V1.9.9 Beta-3 will be available August 18 through distribution.   About GOWIN Semiconductor Corp.   Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   About Andes Technology   Eighteen years in business and a Founding Premier member of RISC-V International, Andes is a publicly listed company (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), a leading supplier of high-performance/ low-power 32/64-bit embedded processor IP solutions, and the driving force in taking RISC-V mainstream. Its V5 RISC-V CPU families range from tiny 32-bit cores to advanced 64-bit Out-of-Order processors with DSP, FPU, Vector, Linux, superscalar, and/or multi/many-core capabilities. By the end of 2022, the cumulative volume of Andes-Embedded™ SoCs has surpassed 12 billion.   For more information, please visit https://www.andestech.com. Follow Andes on LinkedIn, Twitter, Bilibili and YouTube!     Media Contact: Andrew Dudaronek andrew@gowinsemi.com

  London, UK and Guangzhou, China 7th March 2023 - GOWIN Semiconductor Corporation, the world’s fastest-growing FPGA provider, will attend Embedded World 2023 on 14th-16th of March in Nuremberg, Germany. This will be the third time GOWIN has had its own stand (Hall 3A Stand 340) at Embedded World to showcase and demonstrate our latest FPGA technology to the European market.   Embedded World, held annually in Germany, is Europe’s leading trade show for all embedded solutions and technologies. With over 1000 exhibitors it is one of the world’s largest fairs focussing exclusively on state-of-the-art embedded technologies for IoT and related market spaces.   This year GOWIN will be showcasing and demonstrating, amongst other things, our new Arora-V family of high density, high performance, and low power FPGA. Built on a highly optimized TSMC 22nm process this family will compete fiercely with similar competitive FPGA devices by offering not just the lowest power and prices but also pin-compatible footprint options that will offer customers real alternatives without changing their PCB layout.   Also on the stand will be demonstrations of our latest USB offerings which include for the first time a fully integrated FPGA based solution supporting high resolution UAC (USB Audio Class) 2.0 with integrated soft PHY and controller. Additionally, there will be various demos showcasing display and camera solutions.   Lastly, we are very pleased that, for the first time, the sales and technical team will be joined on our stand, by Jason Zhu, GOWIN CEO, who will be hosting various meetings with invited customers and partners. Let us know if you would like to spend some time with an FPGA industry visionary.   “We are immensely proud to be exhibiting again at Embedded World, and to have Jason joining us.” said Mike Furnival, Vice President of International Sales. “It speaks volumes to the progress that we have made during the past year in terms of differentiated as well as pin-compatible FPGA solutions. Whilst we continue to be the lowest cost provider of low and mid density FPGA devices, we are now in the high-density FPGA world and have emerged as one the most innovative in terms of advanced solutions in the marketplace, adding significant value to our customers and partners.”   GOWIN Semiconductor looks forward to welcoming all interested potential customers and partners to our booth in Hall 3A Stand 340.   About GOWIN Semiconductor Corporation   Founded in 2014, GOWIN Semiconductor Corp. with sales and R&D locations worldwide has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership by using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.    For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com

  SAN JOSE, Calif. and GUANGZHOU, China, January. 12, 2023 GOWIN's CEO Jason Zhu is interviewed by the Interface Editorial Department. Jason goes over GOWIN's recent accomplishments and what is in store for 2023.    What kind of company is GOWIN Semiconductor?   GOWIN was established in 2014 and I believe the company's value lies in its awareness of how to develop products that customers need to go directly into the market.   What kind of products are you developing?   Embedded Flash type small FPGA (LittleBee family) mounted on Tang nano board (Sipeed) and higher-grade basic SRAM type FPGA (Arora family). Each of them has a unique product development that is unique from other companies due to implementing additional memory such as pSRAM and SDRAM. We have also developed a USB soft PHY IP which is not found in other companies. In response to market demands, the LittleBee family provides devices with enhanced security functions and devices equipped with Arm Cortex-M3. We always start with the creation of products with the user in mind and provide various types of support along the road to development.   What is the corporate culture at GOWIN?   When looking at GOWIN from the business and corporate culture aspects, we strive to emphasize creativity.  For example, supporting the Tang Nano on the business side hardly contributes to sales, but we enjoy seeing veteran designers and new hobbyists using the platform to create something new. We would like to expand the base for products like Tang Nano to be used in education and hobby. If a product that is especially easy for young people to use enters the market, GOWIN will eventually be known as a company that supports Tang Nano. I think that supporting creative communities within the space is important for that purpose.   How is business going?   Since its establishment, the total number of shipments has exceeded 50 million. Starting from the Chinese market, sales have increased tenfold in markets other than China (as of 2021). GOWIN's main target market is industry with in-vehicle automotive being second. In-vehicle sales are mainly in China, and we would like to work in Japan in the future. With the spread of EVs, GOWIN has become the No. 1 supplier of FPGAs in China. GOWIN devices are mainly manufactured at TSMC's fab (semiconductor manufacturing facility) in Taiwan. LittleBee and Arora have a process rule of 55nm. The new Arora V we recently announced also uses TSMC's 22nm. We have already acquired AEC-Q100 (in-vehicle standard), but we are planning to acquire functional safety ISO26262 next year.   What is your future road map? We are focusing on future product development in 2023. The ES of the Arora V 60K LUT product will be announced in the 2Q of 2023. In parallel with this, the development of the Arora 7 series is underway. We are also considering cloud and data centers in the market, but our policy is to continue with industry as the focus. Currently, there are more cases where users cannot obtain parts or have difficulty grasping the future roadmap. GOWIN will continue to introduce products to the industrial market to solve such problems.   Could you tell us the position of the Japanese market, or rather, tell us about the top five countries in terms of sales, including China, and give us an approximate ratio?   GOWIN attaches great importance to the Japanese market. We focus on what makes the Japanese market unique and different from other countries. Market sales are divided into four regions. 1st China, 2nd Asia Pacific (including Japan, excluding China), 3rd America (including Canada), 4th EU (including Africa and the Middle East), China 55%, non-China 45%. I mentioned earlier that sales outside of China are growing more than 10 times higher, but domestic sales in China are also growing significantly. Due to supply chain problems and changes in the markets that our competitors were focusing on, we were able to enter markets that we could not previously touch.   Will demand for FPGA package standards such as QFP and BGA take precedence? Please explain how the creators make decisions.   Packages are driven by market needs. For the maker community, I don't like BGA. Debugging is difficult and expensive, and it is difficult for the user to check whether it is properly implemented. However, we supply BGA for users who need space-saving and more I/O. It is easier for GOWIN to distribute QFN and QFP. Even with a single lead frame for a BGA, each PCB in the chip must be custom-made. A general-purpose package can use a general-purpose lead frame. The number of pins is about 88 at maximum for QFN and at least 100 for QFP. Optimization for space issues and I/O count is something we can finally address.