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ABOUT US

Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

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PRODUCTS
ARORA V SRAM BASED FPGAS FAMILY
Arora V series of FPGA Products are the second-generation of Arora family, with abundant internal resources, a new-architecture and high-performance DSP supporting AI operations, high-speed LVDS interfaces, and abundant BSRAM resources. Showcasing advanced 22nm SRAM technology and integrating 270Mbps-12.5Gbps high speed SerDes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps. The first family device, GW5AT-138FC676, features 138K LUT logic resources, 6.4MB block RAM, 1.1MB distributed SRAM, along with advanced DSP blocks, and integrated ADC. Future family devices include 25K (non-Serdes) and 60K LUT devices.

Arora V is supported by GOWIN EDA providing an efficient and easy
to use FPGA hardware development environment support multiple RTL
based programming languages, synthesis, placement & routing, bitstream generation and download, power analysis and in-device logic analyzer.
LITTLEBEE FLASH BASED FPGAS FAMILY
GOWIN’s LittleBee® family offers flash based non-volatile FPGAs that are low power and offer small packaging footprints (as small as 2.4x2.3mm). As a result, LittleBee FPGAs are leading the industry in I/O intensive source synchronous interfacing and bridging applications such as MIPI CSI-2, MIPI DSI, USB 2.0, Ethernet, HDMI, MIPI I3C and more. They are also an ideal candidate for hardware management applications offering instant-on booting and built-in security functions.

The LittleBee® FPGA family is complimented by multiple innovative product line sub-features such as extended memory, hardened ARM Cortex-M processor cores, security and Bluetooth LE expanding its capabilities and usage compared to traditional FPGA products.
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MARKET
AI Edge (20201005)
AI AND EDGE COMPUTING
The simulation of human intelligence processes by machines, especially computer systems. Specific applications of AI include expert systems, natural language processing (NLP), speech recognition and machine vision.
commun
COMMUNICATION
Connected to the Future.  From Gbps Ethernet to 5G, GOWIN offers full product portfolio of low power, high-speed interface and small footprint FPGA to meet communication equipment makers’ demand on time-to-market and reduce total...
industry
INDUSTRIAL
Smart, Connected and Green! Industry 4.0 requires machines to be intelligent, connected and energy saving.  Our low power, embedded DDR/SDRAM and high performance DSP , GOWIN FPGA enables industrial manufacturers from industrial...
auto
AUTOMOTIVE
Intelligent, Connected and Safe! Smart and safe driving are today automotive market trends and Advanced Driving Assistance System (ADAS) requires more sensors to be connected in car. GOWIN FPGA provides high IO counts in small form factor...
consumer
CONSUMER
Accelerate your Innovation.  Product differentiation and time-to-market are the critical success factors in today high competitive consumer marketplace.  GOWIN’s low cost, high performance FPGA with our on-the-shelf IP solutions is the answer...
medical
MEDICAL
Visual, Portable and Reliable. The semiconductor contents continue to increase in medical devices and systems as the emerging technology of MEMS and sensor.  Higher resolution of image sensor drives increased resolution, larger size and...
LED DISPLAY
cloud
CLOUD COMPUTING AND DATA CENTERS
High Performance and Programmability. The emerging cloud computing market drives higher performance and programmability of computing and storage devices in data center everyday. With abundant logic and DSP resources, GOWIN AroraTM ...
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NEWS
MJB V1.2 Pic
2022-12-05
GOWIN Semiconductor Corp. Announces New Offerings in MagicJellyBean Educational Program
SAN JOSE, Calif. and GUANGZHOU, China, Dec. 06, 2022 GOWIN Semiconductor Corp. announces new hardware and software offerings in their MagicJellyBean educational program.   GOWIN introduces the MJB™ development board specifically designed for an edge AI learning experience in the education and maker community. This development board enables a seamless connection between programmable logic devices and embedded processors. With both HDMI Rx and Tx interface, users can develop and test their ML models on this board alone. In addition, three accessory boards are offered to help you to deploy various models for different types of data sources: MJB™ camera, MJB™ microphone, and MJB™ accelerometer. All these boards can be purchased at the Amazon GOWIN store near you.   Next, the MJB™ IDE software is an integrated development environment built for MJB machine learning. MJB software integrates with TensorFlow and TensorFlow Lite frameworks to automatically generate AI hardware convolution architectures, MCU C/C++ for driving AI acceleration, and FPGA bitstreams with various sensor inputs. This allows you to deploy machine learning models directly to MJB Board and MJB Mini Board without any FPGA RTL or MCU C/C++ programming. You can download this free software from magicjellybean.org. No License is required.   Lastly, the GOWIN Education version of EDA tools support the FPGA used in MJB™. This allows advanced users to design their MCU+NPU hardware architecture in the FPGA. Significant flexibility is needed in most education programs; GOWIN’s tools allow users to configure the FPGA for their desired application.   “Our focus will be catering to an array of programmers,” said Andrew Dudaronek, Program Director of MagicJellyBean, GOWIN Semiconductor. “Designers will be able to dive into the basics of training a model which will introduce them to TensorFlow. Designers will have an outlet to play with firmware and will have a way to update the C code directly.”   If you are a student diving into FPGAs or a professor looking to start up an FPGA class, MJB™ is a partner and enabler of FPGA educational platforms for universities around the world.   Media contact: admin@magicjellybean.org   MagicJellyBean.org is an organization established to enable hobbyists, academic researchers and electronic enthusiasts with FPGA and microcontroller capabilities for embedded edge electronics projects. The intent is to create a community of like-minded individuals who can share ideas, projects and wisdom in the FPGA and microcontroller field through an affordable and easy to use platform.   Visit MagicJellyBean here: https://magicjellybeanfpga.github.io/mjb/
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MetricsGOWIN PR 2
2022-10-25
GOWIN Semiconductor Partners with Metrics for Simulator Tool
  SAN JOSE, Calif. and GUANGZHOU, China, October 26th, 2022, GOWIN Semiconductor Corp, the world’s fastest-growing programmable logic company, is partnering with Metrics Design Automation to introduce DSim Cloud as part of GOWIN’s FPGA EDA solution. Metrics DSim Cloud is the first full feature, cloud-based simulator that supports SystemVerilog & VHDL design languages.   Simulation is increasingly used by all FPGA designers to ensure that their designs are complete and will function as desired before the FPGA is programmed.   Until now FPGA designers have been forced to make a very difficult tradeoff – either use a very expensive simulator with great function and performance or choose an affordable simulator that isn’t very good. Metrics DSim Cloud fills the gap, providing GOWIN with a simulator that has the function and performance of Cadence and Synopsys simulators but at an incredibly low price. There are no upfront license fees and customers pay by the minute for only the time that they need to simulate. Joe Costello, the Executive Chairman of Metrics said, “This is a great turning point in the FPGA market.  Designers never have to think again about whether they can afford to simulate or whether their simulator is up to the job. Now all GOWIN FPGA designers have a world class simulator with unlimited resources at their fingertips from a single server to thousands of nodes if they need to finish a large test very quickly. True freedom to design and deliver.”     “GOWIN is proud to be the first FPGA company to deliver a cloud-based simulation solution to its customers.  There is something for every designer in this offering.  For smaller customers who previously wouldn’t be able to justify the price of a full-time simulator license, they get a low cost no compromise solution,” said Danny Fisher, Senior FAE Manager, GOWIN Semiconductor Corp, “For larger customers, a cloud-based simulator allows them to do large regressions in the shortest amount of time without investing anything for expensive inhouse server compute-farms and overpriced simulation licenses.   GOWIN will be hosting a webinar on November 16th, 2022, providing additional information on their partnership with Metrics and how the DSim Cloud Verification is the best option for simulation in the FPGA world.Register for the webinar here:https://register.gotowebinar.com/rt/7776141383010986512 For more information about GOWIN, please visit www.gowinsemi.com Copyright 2022 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com
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5AT banner EN 2100x696
2022-09-26
GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V
  San Jose, California and Guangzhou, China, September 26, 2022 - GOWIN Semiconductor Corporation, the world’s fastest growing FPGA company, announces today the release of its new generation Arora V high performance FPGA family utilizing advanced 22nm SRAM technology and integrating 270Mbps-12.5Gbps high speed SerDes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps. The first family device, GW5AT-138FC676, features 138K LUT logic resources, 6.4MB block RAM, 1.1MB distributed SRAM, along with advanced DSP blocks, and integrated ADC. Future family devices include 25K (non-Serdes) and 60K LUT devices. “This new generation Arora V family is an important milestone in GOWIN Semiconductor’s development,” said Jason Zhu, CEO, GOWIN Semiconductor FPGA. “Having entered and now proliferated in the low and mid density FPGA market space, this family further enhances our leadership position and is based on genuine innovation with advanced development. As always, we remain oriented towards providing continuous support for our customer’s need of innovative solutions and true value.” “The Arora V family integrates many innovative hard core modules that have been developed internally by GOWIN, including fully controllable high speed SerDes ideal for supporting applications requiring very high data rates such as communication, video aggregation, and AI computing acceleration. New architecture DSP modules, Block RAM modules supporting ECC error correction, high performance multiple voltage GPIO, and high accuracy clock architecture are all featured in Arora V,” said TP Wang, Chief Technology Officer at GOWIN Semiconductor. “We believe that these new generation Arora V products will provide our customers with higher performance and lower power consumption, while the internally optimized modules will provide customers with more flexible configurations and a better user experience." In addition to advanced hardware design, Arora V integrates many new mainstream hard-core modules as well as soft IP solutions for various interfaces such as PCIe 2.1, MIPI DSI, DDR3, SGMII, XAUI, Gbe, SDI and USB3.1. “These free of charge IP solutions will effectively shorten customer’s time to market delivering additional value,” said Mike Furnival, Vice President of International Sales, GOWIN Semiconductor. “We genuinely believe the launch of Arora V will greatly expand the adoption of GOWIN based solutions in the mid to high density space resulting in further expansion for the development of the global FPGA industry” For more information about GOWIN, please visit www.gowinsemi.com   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. Copyright 2022 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com
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