New cooperation supports makers, educators, and commercial teams requiring fast, low-quantity FPGA access Date – April 30, 2026 — GOWIN Semiconductor today announced a collaboration with JLCPCB, a global PCB fabrication and assembly provider, aimed at improving access to FPGA devices for developers requiring fast prototyping, small-volume production, and low-friction hardware development. Through this cooperation, selected GOWIN FPGA devices will be available within JLCPCB’s component ecosystem via LCSC, enabling simplified sourcing alongside PCB fabrication and assembly services. This approach allows developers to move efficiently from concept to working hardware, reducing the barriers typically associated with small-quantity FPGA procurement. In addition, GOWIN devices are also becoming available through platforms such as HQchip, further expanding access for customers seeking flexible sourcing options across different procurement channels. The collaboration supports a broad range of users — from makers, students, and open-source developers to commercial engineering teams needing rapid prototyping or low-volume production ahead of scale-up. Initial availability will focus on widely used devices within the open hardware ecosystem, including those commonly deployed in Tang Nano, Tang Mega, and related FPGA development platforms. "This collaboration reflects our commitment to lowering barriers to FPGA adoption," said Mike Furnival, VP of International Sales at GOWIN Semiconductor. "By cooperating with platforms like JLCPCB, we are enabling developers, educators, and engineering teams to prototype and iterate faster, while maintaining a clear and supported path to scalable production." Enabling Fast and Accessible FPGA Development The cooperation with JLCPCB enables rapid prototyping and small-volume builds through integrated PCB fabrication and assembly services. It simplifies access to FPGA devices for makers, students, startups, and commercial R&D teams, while supporting fast hardware iteration without complex sourcing requirements or minimum order constraints.   Supporting Flexible Paths from Prototype to Production GOWIN continues to support customers across the full development lifecycle through a complementary, multi-channel approach. This includes: Collaboration with JLCPCB for convenient prototyping and low-volume production Availability through distribution platforms such as HQchip for flexible component sourcing Direct engagement with GOWIN’s global sales organization for volume production, long-term supply assurance, and technical support Availability Selected GOWIN FPGA devices are expected to become available through JLCPCB’s component ecosystem in the coming months, with additional devices introduced based on community and customer demand.   About GOWIN Semiconductor Corporation   Founded in 2014, GOWIN Semiconductor Corporation is dedicated to advancing embedded innovation through high-performance, power-efficient FPGA solutions. Serving markets including industrial automation, robotics, consumer electronics, communications, and emerging AR/VR applications, GOWIN provides flexible and scalable platforms that help customers bring differentiated products to market faster.

London, UK, and Guangzhou, China, March 9, 2026GW1AN and GW3A Expand GOWIN’s Small and Medium FPGA Portfolio GOWIN Semiconductor today announced the launch of its next-generation Arora GW1AN and GW3A FPGA families, expanding its programmable logic portfolio with compact architectures, efficient integration, and dependable performance across industrial, consumer, and embedded applications.   Designed to support the complete FPGA decision chain — including hardware architects, FPGA developers, engineering managers, and component procurement teams — the new families emphasize migration flexibility, sourcing stability, and long-term production planning across EMEA, the United States, and Japan.   Arora GW1AN: Expanded Small FPGA Integration The Arora GW1AN family introduces an enhanced small FPGA architecture focused on system-level efficiency and integration flexibility. Key features include: Redesigned packaging for improved board compatibility Hardened embedded IP subsystems to reduce development complexity Integrated user flash supporting background programming and multi-image reliability Higher-precision ADC resources for monitoring and control systems Pin-compatible migration paths enabling dual-source and risk mitigation strategies The GW1AN series is positioned for industrial control, embedded processing, power management, and cost-sensitive programmable logic designs where compact footprint and long lifecycle support are essential. GW3A: New Medium FPGA Performance Class The GW3A family introduces a hybrid LUT4/LUT6 FPGA architecture combined with optimized hard IP blocks to deliver balanced performance and efficient silicon utilization. With logic densities ranging from approximately 6K to 90K LUTs, GW3A supports: Industrial automation platforms Machine vision systems Video bridging and display connectivity Embedded interface and control applications The architecture is designed to provide strong integration capability while maintaining footprint efficiency for small to medium programmable designs. Designed for Real-World Engineering Requirements Both FPGA families integrate hardened functional blocks aligned with practical system demands, including: Deterministic timing for motor control and FoC applications MIPI connectivity for imaging and vision systems Flexible display and interface bridging Integrated ADC and DSP resources for power and energy applications These capabilities allow designers to reduce external components, simplify system architecture, and optimize board-level efficiency. Regional Focus and Supply Chain Stability The 2026 portfolio expansion reinforces GOWIN’s commitment to: Strong 3.3V I/O drive capability Simplified configuration flows Alignment with legacy device architectures Predictable production planning These attributes address the sourcing, lifecycle, and supply chain priorities of customers across EMEA, the US, and Japan. Executive Perspective “With the introduction of the Arora GW1AN and GW3A families, we are strengthening GOWIN’s position in both the small and medium FPGA markets,” said Mike Furnival, VP International Sales and GM of the UK Office at GOWIN Semiconductor. “Our customers are asking for integration efficiency, migration flexibility, and dependable production planning. These new families are designed specifically to address those needs while delivering the performance and architectural balance modern embedded systems require.” Availability The Arora GW1AN and GW3A families will roll out throughout 2026, with technical documentation, development tools, and evaluation platforms available through GOWIN’s global support network. For detailed specifications, evaluation hardware, or migration support, please contact your local GOWIN Semiconductor representative or visit the GOWIN Technical Resource Center. About GOWIN Semiconductor Corporation Founded in 2014, GOWIN Semiconductor Corporation is dedicated to advancing embedded innovation through high-performance, power-efficient FPGA solutions. Serving markets including industrial automation, robotics, consumer electronics, communications, and emerging AR/VR applications, GOWIN provides flexible and scalable platforms that help customers bring differentiated products to market faster.

London, UK, and Guangzhou, China, January 22, 2026GOWIN Semiconductor Corporation, a leading global provider of FPGA solutions, is pleased to announce its participation in Embedded World 2026, taking place March 10–12, 2026, in Nuremberg, Germany. This marks GOWIN’s continued presence at the world’s premier embedded systems exhibition. Attendees are invited to visit Hall 3A, Stand 340, where GOWIN will connect with developers, partners, and system designers shaping the future of embedded computing. Enabling Next-Generation Embedded Systems with FPGAs As embedded applications continue to evolve, system designers face growing demands for real-time performance, low latency, power efficiency, and interface flexibility. FPGAs play a critical role in addressing these challenges by enabling highly parallel processing, deterministic behavior, and adaptable hardware architectures. At Embedded World 2026, GOWIN will highlight how its FPGA platforms support a wide range of modern embedded use cases - particularly in AR/VR, robotics, and intelligent edge systems-where responsiveness, efficiency, and system integration are key. Focus Areas at Embedded World 2026 AR/VR Systems Augmented and virtual reality applications place strict requirements on latency, bandwidth, and power consumption. GOWIN FPGAs are well suited for AR/VR system architectures, enabling: Real-time sensor processing and display pipelines Ultra-low-latency data paths to reduce motion-to-photon delay Flexible support for high-speed display and camera interfaces Efficient offloading of vision and AI-related workloads Robotics and Intelligent Automation Robotics systems demand precise timing, deterministic control, and seamless integration of sensors, motors, and communication interfaces. GOWIN FPGAs help robotics developers: Implement real-time motor control and motion algorithms Process sensor and vision data with low and predictable latency Integrate multiple interfaces within a single, flexible platform Scale designs from prototyping to production efficiently Flexible FPGA Platforms for Embedded Innovation Across AR/VR, robotics, industrial, and consumer applications, GOWIN’s FPGA portfolio supports designers with: Power-efficient architectures suitable for edge and mobile systems Pin-compatible device options to simplify design migration Cost-effective solutions that balance performance and system integration A growing ecosystem of development tools, IP, and reference designs Join GOWIN at Embedded World 2026 “We’re excited to return to Embedded World and continue conversations with the global embedded community,” said Mike Furnival, Vice President of International Sales at GOWIN Semiconductor. “Embedded systems are becoming more complex and performance-driven, and FPGAs remain a powerful enabler for applications like AR/VR and robotics. Embedded World is an ideal place to exchange ideas and explore how flexible FPGA platforms can support next-generation designs.” GOWIN invites attendees to stop by Hall 3A, Stand 340 to discuss application challenges, system architectures, and how FPGAs can accelerate embedded innovation. Supporting Resources Schedule a Meeting: To arrange a meeting with GOWIN Semiconductor at Embedded World 2026, contact us at info@gowinsemi.com Learn More About GOWIN Semiconductor: https://www.gowinsemi.com/en/ Embedded World 2026 Information: https://www.embedded-world.de/en About GOWIN Semiconductor Corporation Founded in 2014, GOWIN Semiconductor Corporation is dedicated to advancing embedded innovation through high-performance, power-efficient FPGA solutions. Serving markets including industrial automation, robotics, consumer electronics, communications, and emerging AR/VR applications, GOWIN provides flexible and scalable platforms that help customers bring differentiated products to market faster.