In order to optimize your browsing experience we uses cookies. You agree to the usage of cookies when you browsing this site.
For more information regarding cookies and the processing of your personal data please read our Privacy Policy.
I understand
ABOUT US

Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

Learn More
MARKET
commun
COMMUNICATION
Connected to the Future.  From Gbps Ethernet to 5G, GOWIN offers full product portfolio of low power, high-speed interface and small footprint FPGA to meet communication equipment makers’ demand on time-to-market and reduce total...
industry
INDUSTRIAL
Smart, Connected and Green! Industry 4.0 requires machines to be intelligent, connected and energy saving.  Our low power, embedded DDR/SDRAM and high performance DSP , GOWIN FPGA enables industrial manufacturers from industrial...
auto
AUTOMOTIVE
Intelligent, Connected and Safe! Smart and safe driving are today automotive market trends and Advanced Driving Assistance System (ADAS) requires more sensors to be connected in car. GOWIN FPGA provides high IO counts in small form factor...
consumer
CONSUMER
Accelerate your Innovation.  Product differentiation and time-to-market are the critical success factors in today high competitive consumer marketplace.  GOWIN’s low cost, high performance FPGA with our on-the-shelf IP solutions is the answer...
medical
MEDICAL
Visual, Portable and Reliable. The semiconductor contents continue to increase in medical devices and systems as the emerging technology of MEMS and sensor.  Higher resolution of image sensor drives increased resolution, larger size and...
cloud
CLOUD COMPUTING AND DATA CENTERS
High Performance and Programmability. The emerging cloud computing market drives higher performance and programmability of computing and storage devices in data center everyday. With abundant logic and DSP resources, GOWIN AroraTM ...
Learn More
NEWS
GOWIN EDA IP (20200507)
2020-05-07
GOWIN Semiconductor Integrates their latest HDMI/DVI RX and TX IP into GOWIN EDA IP Generator
  Click the picture to watch the video     SAN JOSE, Calif. and GUANGZHOU, China, May 25, 2020 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their HDMI/DVI RX and TX IPs in GOWIN EDA’s IP Generator providing low cost video interfacing and connectivity solutions for various embedded applications.   HDMI and DVI is one the most common video interfaces used today. With advancements and performance improvements in semiconductor devices, many solutions have focused on higher data rates for both resolution and frame rate improvements. This has left a significant gap for solutions that don’t need extremely high resolutions or frame rates and are very sensitive to their final end product cost.   As a result, GOWIN has developed HDMI and DVI IPs for both receiving and transmitting video data to target resolutions more common to embedded equipment such as 1080p30 or 1280x800p60. These solutions provide a much lower over all solution cost when compared to ASIC bridges or SoCs that often contain more advanced features than what the end product actually requires. “We have found many opportunities to help our customers reduce BOM cost on kiosks and industrial displays, where frame rate is less critical,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.   GOWIN’s HDMI/DVI IP’s have been seen in a broad range of consumer, industrial, and automotive applications. In some cases, the IP’s are used in low density GOWIN FPGA’s for video bridging from one video interface to another. For example, many industrial and consumer kiosks have an HDMI input which drives a Single-Link or Dual-Link LVDS display directly. As a result, GOWIN has created a reference design specifically for this bridging application, which can scale to FPGAs as small as the GOWIN LittleBee GW1N-1, 1K LUT FPGA. Other display interfaces such as MIPI DSI and DPI can also be targeted.   In other situations, the GOWIN HDMI/DVI IP is used with a larger GOWIN FPGAs to create a custom system-on-chip that includes HDMI interfacing. In these situations, devices can utilize video streams HDMI inputs and outputs to perform graphics and video processing. Specialty devices such as the GOWIN GW2AR18 can provide internal frame buffers using its extended 8MB PSRAM making it great for developing custom video SoCs.   “The market has seen a lack of solutions for embedded equipment display applications,” said Scott Casper, Director of Sales for GOWIN Semiconductor. “GOWIN’s HDMI/DVI IP allows for flexibility in video signal bridging and processing with cost effective product development.”   The GOWIN HDMI RX IP was demonstrated as part of a HDMI to LVDS display solution recently at Embedded World 2020. GOWIN’s HDMI TX IP was also demonstrated as part of their GoAI artificial intelligence solution. These demos showed video processing of HDMI data using GOWIN FPGAs at resolutions of 1280x800p60 and 1920x1080p30 respectively.     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2020 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com  
Learn More
startup-593305_960_720
2020-04-20
New York Institute of Technology -Vancouver Develops Secure Boot Application for GOWIN SecureFPGA
  GOWIN Semiconductor announced their SecureFPGA devices in 2019 which enable hardware PUF (Physically Unclonable Functionality) based security providing a root of trust on their µSoC FPGAs.  Since then, GOWIN has been working with various security technologists to develop use case examples in order to fast track embedded security development on their embedded devices.   NYIT-Vancouver (New York Institute of Technology Vancouver Campus) started developing solutions with GOWIN SecureFPGAs as part of their INCS 870 Cyber Security graduate capstone course As part of this course, students worked with GOWIN to solve general purpose security problems using the GOWIN SecureFPGA µSoC FPGA and developed a secure boot example using the included Intrinsic ID Broadkey security library.   Secure Boot is an industry standard that ensures that any device boots using only software that  is digitally signed and verified by the Original Equipment Manufacturer (OEM). The device may be a PC or an embedded device. Typically, the secure boot process runs over a small amount of boot code prior to any application software. The process involves digital signature verification over the application firmware using an asymmetric key pair.   “After completing this project, students gained valuable experience in embedded system development. The multi-faceted nature of such systems makes it challenging to give students exposure to and experience in all facets of such systems,” said Yunlong Shao, Assistant Professor for the INCS 870 course at NYIT-Vancouver.   “In this capstone project, students used GOWIN’s SecureFPGA system and its Broadkey security library to perform the signature verification process over application firmware using an asymmetric key pair. The use of the Broadkey security library gave students practical experience and a sense of accomplishment, while reinforcing theoretical concepts. The results show that students perceived the project positively and that the learning objectives were met.”   SecureFPGA provides several additional layers of security for the secure boot process.  First, SecureFPGA devices can be factory provisioned so that the root key pair of the device is initialized at the GOWIN factory floor.  Second, the device uses SRAM based PUF technology taking intrinsic silicon properties of their device’s hardware SRAM to regenerate a root key pair rather than storing it in the device.  Third, the private key is protected in a secure enclave that is never available to the developer and can only be accessed through the provided Broadkey security library.   “Secure boot is one of the most common requests we receive for customers wanting to add security capabilities to their embedded products,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.  “Partnering with New York Institute of Technology – Vancouver gave us incredibly valuable insight into our security product offering from graduate students with domain expertise specifically in cybersecurity.”   As a result of this successful capstone project by New York Tech - Vancouver, an example design is now provided at www.gowinsemi.com and can be evaluated using the DK-Start-GW1NSE-2C development kit from GOWIN providing developers an great starting point to integrate application firmware checking in their next product.   Duo Xu, graduate student at New York Tech -Vancouver explained that  “In order to perform a secure boot, the developer needs to provide the start address and the size in bytes of the application firmware that will be verified using a digital signature . In the digital signature generation process, the program will initialize the ID Broadkey security library and generate the digital signature that is stored it in flash memory. As soon as the signature generation process finishes, the secure boot function can be called in any part of the code to regenerate the signature, compare it with the signature stored in flash memory, to verify that the application hasn’t been modified. If the verification is successful, the boot process jumps to the first address of firmware, if not, it shows an error message and jumps into an infinite loop.”   GOWIN Semiconductor looks forward to continuing collaboration projects through their overseas university program that enable successful application starting points for their customers.  For more information on GOWIN Semiconductor and their SecureFPGA product visit www.gowinsemi.com.   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
Learn More
Bluetooth module CE-RED approved (20200407)
2020-04-07
Gowin Semiconductor Obtains EU-RED Certification for their Bluetooth Low Energy µSoC FPGA Production Modules
  SAN JOSE, Calif. and GUANGZHOU, China, April 6, 2020 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, obtains BLE module certification for Europe allowing developers to quickly and easily integrate the GW1NRF-4 µSoC FPGA BLE module into their end-products.     Late last year, GOWIN Semiconductor announced the release of the first FPGA with integrated Bluetooth Low Energy Radio called the GW1NRF-4 delivering a new generation of wireless product capabilities for end-product developers. The device provides a 4.6k LUT FPGA, a 32-bit power-optimized ARC processor and a Bluetooth Low Energy radio in a single 6x6mm QFN package. Since then GOWIN has been actively maturing product and solution support enabling easy and fast customer integration of the device. As a result, GOWIN is now producing pre-certified GW1NRF BLE modules.     Wireless IC’s are often productized by semiconductor manufacturers in two forms. Some developers require integration of the Bluetooth chip itself onto their own system circuit board. In this case, developers are required to certify their circuit board with wireless capabilities in the geography to which the product will be sold. This adds an additional cost burden to end product manufacturers, but with the benefit of having more flexibility on the chip integration. Another option is to integrate a PCB module instead that is already certified. The module contains the wireless chip and required circuitry such as decoupling capacitors, oscillators and antennas. The pre-certified PCB module can then be integrated onto a larger system circuit board without recertifying the rest of the system.     “Many wireless customers request pre-certified GW1NRF-4 modules over the chip itself” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor. “Certification for each country a wireless product is intended to be sold in can be a significant cost and technical knowledge burden. As a result, GOWIN Semiconductor offers pre-certified GW1NRF-4 Bluetooth Low Energy modules that can be easily designed into products without performing additional certification.”     The GOWIN GW1NRF-4 Certified Bluetooth module is a 19x20mm module that includes the GW1NRF-4 device, all required passives, crystal oscillators and an antenna creating a ‘plug and play’ path to enabling products with FPGA and Bluetooth capabilities.     GOWIN recently showcased the GW1NRF-4 BLE enabled FPGA at Embedded World 2020 and is continuing to develop unique connectivity examples around the device to quickly enable their customers with Bluetooth FPGA capabilities.     “We are very excited that, following a very successful showcase at Embedded World, we have achieved EU certification for the world’s first Bluetooth enabled FPGA module” said Mike Furnival, Director of EMEA Sales at GOWIN Semiconductor. “Without question, our representatives, distributors, design partners and customers clearly believe that GOWIN’s continued innovation, especially in the IoT space, genuinely adds value in enabling the creation new and differentiated solutions.”     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.     For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com     Media Contact: Scott Casper scott@gowinsemi.com
Learn More