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Programming the future
Gowin Semiconductor Obtains EU-RED Certification for their Bluetooth Low Energy µSoC FPGA Production Modules


SAN JOSE, Calif. and GUANGZHOU, China, April 6, 2020 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, obtains BLE module certification for Europe allowing developers to quickly and easily integrate the GW1NRF-4 µSoC FPGA BLE module into their end-products.



Late last year, GOWIN Semiconductor announced the release of the first FPGA with integrated Bluetooth Low Energy Radio called the GW1NRF-4 delivering a new generation of wireless product capabilities for end-product developers. The device provides a 4.6k LUT FPGA, a 32-bit power-optimized ARC processor and a Bluetooth Low Energy radio in a single 6x6mm QFN package. Since then GOWIN has been actively maturing product and solution support enabling easy and fast customer integration of the device. As a result, GOWIN is now producing pre-certified GW1NRF BLE modules.



Wireless IC’s are often productized by semiconductor manufacturers in two forms. Some developers require integration of the Bluetooth chip itself onto their own system circuit board. In this case, developers are required to certify their circuit board with wireless capabilities in the geography to which the product will be sold. This adds an additional cost burden to end product manufacturers, but with the benefit of having more flexibility on the chip integration. Another option is to integrate a PCB module instead that is already certified. The module contains the wireless chip and required circuitry such as decoupling capacitors, oscillators and antennas. The pre-certified PCB module can then be integrated onto a larger system circuit board without recertifying the rest of the system.



“Many wireless customers request pre-certified GW1NRF-4 modules over the chip itself” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor. “Certification for each country a wireless product is intended to be sold in can be a significant cost and technical knowledge burden. As a result, GOWIN Semiconductor offers pre-certified GW1NRF-4 Bluetooth Low Energy modules that can be easily designed into products without performing additional certification.”



The GOWIN GW1NRF-4 Certified Bluetooth module is a 19x20mm module that includes the GW1NRF-4 device, all required passives, crystal oscillators and an antenna creating a ‘plug and play’ path to enabling products with FPGA and Bluetooth capabilities.



GOWIN recently showcased the GW1NRF-4 BLE enabled FPGA at Embedded World 2020 and is continuing to develop unique connectivity examples around the device to quickly enable their customers with Bluetooth FPGA capabilities.



“We are very excited that, following a very successful showcase at Embedded World, we have achieved EU certification for the world’s first Bluetooth enabled FPGA module” said Mike Furnival, Director of EMEA Sales at GOWIN Semiconductor. “Without question, our representatives, distributors, design partners and customers clearly believe that GOWIN’s continued innovation, especially in the IoT space, genuinely adds value in enabling the creation new and differentiated solutions.”



About GOWIN Semiconductor Corp.

Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.



For more information about GOWIN, please visit

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Media Contact:

Scott Casper