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Embedded World Flyer 2023 P3 (2100 × 696 px)
2023-03-06
GOWIN Semiconductor to attend Embedded World 2023   London, UK and Guangzhou, China 7th March 2023 - GOWIN Semiconductor Corporation, the world’s fastest-growing FPGA provider, will attend Embedded World 2023 on 14th-16th of March in Nuremberg, Germany. This will be the third time GOWIN has had its own stand (Hall 3A Stand 340) at Embedded World to showcase and demonstrate our latest FPGA technology to the European market.   Embedded World, held annually in Germany, is Europe’s leading trade show for all embedded solutions and technologies. With over 1000 exhibitors it is one of the world’s largest fairs focussing exclusively on state-of-the-art embedded technologies for IoT and related market spaces.   This year GOWIN will be showcasing and demonstrating, amongst other things, our new Arora-V family of high density, high performance, and low power FPGA. Built on a highly optimized TSMC 22nm process this family will compete fiercely with similar competitive FPGA devices by offering not just the lowest power and prices but also pin-compatible footprint options that will offer customers real alternatives without changing their PCB layout.   Also on the stand will be demonstrations of our latest USB offerings which include for the first time a fully integrated FPGA based solution supporting high resolution UAC (USB Audio Class) 2.0 with integrated soft PHY and controller. Additionally, there will be various demos showcasing display and camera solutions.   Lastly, we are very pleased that, for the first time, the sales and technical team will be joined on our stand, by Jason Zhu, GOWIN CEO, who will be hosting various meetings with invited customers and partners. Let us know if you would like to spend some time with an FPGA industry visionary.   “We are immensely proud to be exhibiting again at Embedded World, and to have Jason joining us.” said Mike Furnival, Vice President of International Sales. “It speaks volumes to the progress that we have made during the past year in terms of differentiated as well as pin-compatible FPGA solutions. Whilst we continue to be the lowest cost provider of low and mid density FPGA devices, we are now in the high-density FPGA world and have emerged as one the most innovative in terms of advanced solutions in the marketplace, adding significant value to our customers and partners.”   GOWIN Semiconductor looks forward to welcoming all interested potential customers and partners to our booth in Hall 3A Stand 340.   About GOWIN Semiconductor Corporation   Founded in 2014, GOWIN Semiconductor Corp. with sales and R&D locations worldwide has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership by using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.    For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com
Jason pic HQ
2023-01-12
Interface Magazine interview with GOWIN's CEO, Jason Zhu   SAN JOSE, Calif. and GUANGZHOU, China, January. 12, 2023 GOWIN's CEO Jason Zhu is interviewed by the Interface Editorial Department. Jason goes over GOWIN's recent accomplishments and what is in store for 2023.    What kind of company is GOWIN Semiconductor?   GOWIN was established in 2014 and I believe the company's value lies in its awareness of how to develop products that customers need to go directly into the market.   What kind of products are you developing?   Embedded Flash type small FPGA (LittleBee family) mounted on Tang nano board (Sipeed) and higher-grade basic SRAM type FPGA (Arora family). Each of them has a unique product development that is unique from other companies due to implementing additional memory such as pSRAM and SDRAM. We have also developed a USB soft PHY IP which is not found in other companies. In response to market demands, the LittleBee family provides devices with enhanced security functions and devices equipped with Arm Cortex-M3. We always start with the creation of products with the user in mind and provide various types of support along the road to development.   What is the corporate culture at GOWIN?   When looking at GOWIN from the business and corporate culture aspects, we strive to emphasize creativity.  For example, supporting the Tang Nano on the business side hardly contributes to sales, but we enjoy seeing veteran designers and new hobbyists using the platform to create something new. We would like to expand the base for products like Tang Nano to be used in education and hobby. If a product that is especially easy for young people to use enters the market, GOWIN will eventually be known as a company that supports Tang Nano. I think that supporting creative communities within the space is important for that purpose.   How is business going?   Since its establishment, the total number of shipments has exceeded 50 million. Starting from the Chinese market, sales have increased tenfold in markets other than China (as of 2021). GOWIN's main target market is industry with in-vehicle automotive being second. In-vehicle sales are mainly in China, and we would like to work in Japan in the future. With the spread of EVs, GOWIN has become the No. 1 supplier of FPGAs in China. GOWIN devices are mainly manufactured at TSMC's fab (semiconductor manufacturing facility) in Taiwan. LittleBee and Arora have a process rule of 55nm. The new Arora V we recently announced also uses TSMC's 22nm. We have already acquired AEC-Q100 (in-vehicle standard), but we are planning to acquire functional safety ISO26262 next year.   What is your future road map? We are focusing on future product development in 2023. The ES of the Arora V 60K LUT product will be announced in the 2Q of 2023. In parallel with this, the development of the Arora 7 series is underway. We are also considering cloud and data centers in the market, but our policy is to continue with industry as the focus. Currently, there are more cases where users cannot obtain parts or have difficulty grasping the future roadmap. GOWIN will continue to introduce products to the industrial market to solve such problems.   Could you tell us the position of the Japanese market, or rather, tell us about the top five countries in terms of sales, including China, and give us an approximate ratio?   GOWIN attaches great importance to the Japanese market. We focus on what makes the Japanese market unique and different from other countries. Market sales are divided into four regions. 1st China, 2nd Asia Pacific (including Japan, excluding China), 3rd America (including Canada), 4th EU (including Africa and the Middle East), China 55%, non-China 45%. I mentioned earlier that sales outside of China are growing more than 10 times higher, but domestic sales in China are also growing significantly. Due to supply chain problems and changes in the markets that our competitors were focusing on, we were able to enter markets that we could not previously touch.   Will demand for FPGA package standards such as QFP and BGA take precedence? Please explain how the creators make decisions.   Packages are driven by market needs. For the maker community, I don't like BGA. Debugging is difficult and expensive, and it is difficult for the user to check whether it is properly implemented. However, we supply BGA for users who need space-saving and more I/O. It is easier for GOWIN to distribute QFN and QFP. Even with a single lead frame for a BGA, each PCB in the chip must be custom-made. A general-purpose package can use a general-purpose lead frame. The number of pins is about 88 at maximum for QFN and at least 100 for QFP. Optimization for space issues and I/O count is something we can finally address.  
MJB V1.2 Pic
2022-12-05
GOWIN Semiconductor Corp. Announces New Offerings in MagicJellyBean Educational Program SAN JOSE, Calif. and GUANGZHOU, China, Dec. 06, 2022 GOWIN Semiconductor Corp. announces new hardware and software offerings in their MagicJellyBean educational program.   GOWIN introduces the MJB™ development board specifically designed for an edge AI learning experience in the education and maker community. This development board enables a seamless connection between programmable logic devices and embedded processors. With both HDMI Rx and Tx interface, users can develop and test their ML models on this board alone. In addition, three accessory boards are offered to help you to deploy various models for different types of data sources: MJB™ camera, MJB™ microphone, and MJB™ accelerometer. All these boards can be purchased at the Amazon GOWIN store near you.   Next, the MJB™ IDE software is an integrated development environment built for MJB machine learning. MJB software integrates with TensorFlow and TensorFlow Lite frameworks to automatically generate AI hardware convolution architectures, MCU C/C++ for driving AI acceleration, and FPGA bitstreams with various sensor inputs. This allows you to deploy machine learning models directly to MJB Board and MJB Mini Board without any FPGA RTL or MCU C/C++ programming. You can download this free software from magicjellybean.org. No License is required.   Lastly, the GOWIN Education version of EDA tools support the FPGA used in MJB™. This allows advanced users to design their MCU+NPU hardware architecture in the FPGA. Significant flexibility is needed in most education programs; GOWIN’s tools allow users to configure the FPGA for their desired application.   “Our focus will be catering to an array of programmers,” said Andrew Dudaronek, Program Director of MagicJellyBean, GOWIN Semiconductor. “Designers will be able to dive into the basics of training a model which will introduce them to TensorFlow. Designers will have an outlet to play with firmware and will have a way to update the C code directly.”   If you are a student diving into FPGAs or a professor looking to start up an FPGA class, MJB™ is a partner and enabler of FPGA educational platforms for universities around the world.   Media contact: admin@magicjellybean.org   MagicJellyBean.org is an organization established to enable hobbyists, academic researchers and electronic enthusiasts with FPGA and microcontroller capabilities for embedded edge electronics projects. The intent is to create a community of like-minded individuals who can share ideas, projects and wisdom in the FPGA and microcontroller field through an affordable and easy to use platform.   Visit MagicJellyBean here: https://magicjellybeanfpga.github.io/mjb/
MetricsGOWIN PR 2
2022-10-25
GOWIN Semiconductor Partners with Metrics for Simulator Tool   SAN JOSE, Calif. and GUANGZHOU, China, October 26th, 2022, GOWIN Semiconductor Corp, the world’s fastest-growing programmable logic company, is partnering with Metrics Design Automation to introduce DSim Cloud as part of GOWIN’s FPGA EDA solution. Metrics DSim Cloud is the first full feature, cloud-based simulator that supports SystemVerilog & VHDL design languages.   Simulation is increasingly used by all FPGA designers to ensure that their designs are complete and will function as desired before the FPGA is programmed.   Until now FPGA designers have been forced to make a very difficult tradeoff – either use a very expensive simulator with great function and performance or choose an affordable simulator that isn’t very good. Metrics DSim Cloud fills the gap, providing GOWIN with a simulator that has the function and performance of Cadence and Synopsys simulators but at an incredibly low price. There are no upfront license fees and customers pay by the minute for only the time that they need to simulate. Joe Costello, the Executive Chairman of Metrics said, “This is a great turning point in the FPGA market.  Designers never have to think again about whether they can afford to simulate or whether their simulator is up to the job. Now all GOWIN FPGA designers have a world class simulator with unlimited resources at their fingertips from a single server to thousands of nodes if they need to finish a large test very quickly. True freedom to design and deliver.”     “GOWIN is proud to be the first FPGA company to deliver a cloud-based simulation solution to its customers.  There is something for every designer in this offering.  For smaller customers who previously wouldn’t be able to justify the price of a full-time simulator license, they get a low cost no compromise solution,” said Danny Fisher, Senior FAE Manager, GOWIN Semiconductor Corp, “For larger customers, a cloud-based simulator allows them to do large regressions in the shortest amount of time without investing anything for expensive inhouse server compute-farms and overpriced simulation licenses.   GOWIN will be hosting a webinar on November 16th, 2022, providing additional information on their partnership with Metrics and how the DSim Cloud Verification is the best option for simulation in the FPGA world.Register for the webinar here:https://register.gotowebinar.com/rt/7776141383010986512 For more information about GOWIN, please visit www.gowinsemi.com Copyright 2022 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com
5AT banner EN 2100x696
2022-09-26
GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V   San Jose, California and Guangzhou, China, September 26, 2022 - GOWIN Semiconductor Corporation, the world’s fastest growing FPGA company, announces today the release of its new generation Arora V high performance FPGA family utilizing advanced 22nm SRAM technology and integrating 270Mbps-12.5Gbps high speed SerDes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps. The first family device, GW5AT-138FC676, features 138K LUT logic resources, 6.4MB block RAM, 1.1MB distributed SRAM, along with advanced DSP blocks, and integrated ADC. Future family devices include 25K (non-Serdes) and 60K LUT devices. “This new generation Arora V family is an important milestone in GOWIN Semiconductor’s development,” said Jason Zhu, CEO, GOWIN Semiconductor FPGA. “Having entered and now proliferated in the low and mid density FPGA market space, this family further enhances our leadership position and is based on genuine innovation with advanced development. As always, we remain oriented towards providing continuous support for our customer’s need of innovative solutions and true value.” “The Arora V family integrates many innovative hard core modules that have been developed internally by GOWIN, including fully controllable high speed SerDes ideal for supporting applications requiring very high data rates such as communication, video aggregation, and AI computing acceleration. New architecture DSP modules, Block RAM modules supporting ECC error correction, high performance multiple voltage GPIO, and high accuracy clock architecture are all featured in Arora V,” said TP Wang, Chief Technology Officer at GOWIN Semiconductor. “We believe that these new generation Arora V products will provide our customers with higher performance and lower power consumption, while the internally optimized modules will provide customers with more flexible configurations and a better user experience." In addition to advanced hardware design, Arora V integrates many new mainstream hard-core modules as well as soft IP solutions for various interfaces such as PCIe 2.1, MIPI DSI, DDR3, SGMII, XAUI, Gbe, SDI and USB3.1. “These free of charge IP solutions will effectively shorten customer’s time to market delivering additional value,” said Mike Furnival, Vice President of International Sales, GOWIN Semiconductor. “We genuinely believe the launch of Arora V will greatly expand the adoption of GOWIN based solutions in the mid to high density space resulting in further expansion for the development of the global FPGA industry” For more information about GOWIN, please visit www.gowinsemi.com   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. Copyright 2022 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com
WPG_PR
2022-02-08
GOWIN Semiconductor appoints WPG as pan-European Distributor   London, United Kingdom, 1st February 2022 --GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, today announces a new strategic partnership by appointing WPG EMEA, part of WPG Holdings, the world’s largest semiconductor distributor, as a pan-European distributor. WPG joins established pan European and Americas distribution partner Rutronik, as well as a number of independent local distributors offering extensive customer choice for service and support.   “We are really excited to be joining forces with WPG at this important time in GOWIN Semiconductor’s corporate development” said Mike Furnival, Vice President of International Sales. “There are clear gaps in the FPGA market as previously established manufacturers in the low and mid-range space focus on higher density solutions. GOWIN’s aggressive pursuit of innovative solutions in these markets coupled with the enthusiasm and drive of WPG should provide our customers with much higher level of service and support.”    “The FPGA market has needed new blood for a very long time, the acquisitions of Altera by Intel and Xilinx by AMD, have created the opportunity for another strong player to enter the market offering customers choice and competition, Gowin certainly fit that profile. The EMEA market has long been regarded as a target rich environment for FPGA and other programmable logic vendors, the technology portfolio of Gowin provides customers access to replacement products for existing designs as well as disruptive solutions for new design opportunities”, commented Nigel Watts, President EMEA for WPG. Watts added, “ WPG EMEA is a demand creation focused distributor building a strong and disruptive technology portfolio, Gowin is a very welcome addition and one we will drive hard and support our customers to the very best of our abilities”. About GOWIN Semiconductor Corp.   Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   About WPG   WPG EMEA BV is a wholly owned subsidiary of WPG Holdings, the world’s largest semiconductor distributor. WPG EMEA was established during 2021 and is focused on a true demand creation strategy and supporting the global activities of WPG.   More detail can be found by visiting the corporate website www.wpgholdings.com or locally at www.wpgemea.com . Alternatively you can mail info@wpgemea.com   Copyright 2021 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
hi-speed-usb-logo
2022-01-27
GOWIN Semiconductor USB 2.0 PHY Interface and Device Controller IPs Achieve USB-IF Certification   SAN JOSE, Calif. and GUANGZHOU, China, Jan. 27, 2022 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corp, the world’s fastest-growing programmable logic company, obtains USB Implementers Forum (USB-IF) certification for its USB 2.0 PHY Interface and Device Controller IPs upon passing compliance testing at Granite River Labs, a USB-IF Authorized Independent Test Lab (ITL).   Earlier last year, GOWIN announced their FPGAs now offer the industry’s first USB 2.0 PHY Interface and complementing USB 2.0 Device Controller IP. GOWIN also announced additional solutions for UVC (Universal Video Class) and UAC (Universal Audio Class) support, a new product line of USB peripheral bridging ASSPs and native OS driver support for a variety of solutions. Additional and expanded solutions are anticipated to be announced over the course of Y2022 showing fast and continuous growth in USB support and capabilities by the company.   GOWIN’s patented USB solutions continue to be designed in to end products, and the USB 1.1 and 2.0 PHY and Device Controller IPs were aggressively tested against the USB 1.1 and 2.0 CTS both by GOWIN and by Granite River Labs (GRL), a USB-IF Authorized Independent Test Lab (ITL). The USB-IF reviewed the compliance test data submitted by GRL and approved certification of GOWIN’s USB 2.0 PHY Interface and Device Controller IPs for Littlebee and Arora FPGA devices, which makes GOWIN the first FPGA company to provide integrated USB 2.0 PHY support and compliance.   “GRL performed USB 2.0 Peripheral Silicon Compliance Testing on GOWIN’s PHY Interface and Device Controller IPs for Littlebee and Arora FPGA products,” said Quintin Anderson, Chief Operating Officer at Granite River Labs. “The products passed the USB-IF Compliance Program’s rigorous test requirements, achieved USB-IF certification, and were added to the Integrator's List in early January 2022.”   “FPGAs in production applications are often more limited in interface connectivity, throughput testing and support than their ability to adequately and efficiently process data. The fully programmable USB interface solutions on GOWIN FPGAs allow product developers to communicate over one of the most common electrical interfaces in the industry,” said Grant Jennings, Senior Director of International Marketing at GOWIN Semiconductor.    “There are still interfaces that FPGAs do not support or that lack compliance. This often results in solutions that do not make it to volume production or have subtle underlying issues in the field. Achieving USB 1.1 and 2.0 certification on our PHY Interface and Device Controller FPGA IPs is a testament to GOWIN’s ability to not only innovate, but support those innovations to production products.”   GOWIN will offer a webinar in Q1Y2022 providing additional information on their FPGAs with USB 2.0 PHY and controller capabilities. It will also cover additional link layer solutions available from GOWIN including UVC (Universal Video Class), UAC (Universal Audio Class), HID (Human Interface Device), USB HSIC (High Speed Inter-Chip), HUB designs and more.For more information about GOWIN, please visit www.gowinsemi.com Copyright 2022 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com
DCIM
2021-12-16
Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests SAN JOSE, Calif. Dec. 16, 2021, GOWIN Semiconductor Corp. and Shanghai Automobile Transmission announced that GOWIN Semiconductor’s automotive-grade FPGAs passed SAIC’s 2500h heat resistance test, high and low heat cycling resistance with load test, heat impact test, vibration impact test, and 30,000km vehicle test.   FPGAs are becoming a required component in automotive development with the increased focus on EVs (Electronic Vehicles) as well as dramatic innovations in Advanced Driving Assistance System (ADAS), Autonomous Driving (AD), LIDAR, In-vehicle Infotainment (IVI) and Driver Information (DI) applications.  As a result, automotive manufacturers are performing independent certification tests on Gowin’s AEC-100Q Automotive qualified devices.   According to Huajing Industry Research Institute, the global automotive semiconductor market is expected to reach $65.1 billion in 2022, accounting for nearly 12% of the global semiconductor market becoming the fastest growing semiconductor segment. FPGAs provide flexibility and parallel processing capabilities resulting in  wide range of uses; especially for the development of autonomous driving technology.  This has significantly increased the FPGA market share in the automotive segment, which is expected exceed $2.5 billion by 2025.   “GOWIN’s automotive-grade FPGA has passed a variety of SAIC’s tests such as heat resistance test, high and low heat cycling resistance with load test, 30,000km vehicle test. and so on,” said Li Yu, chief engineer of Shanghai Automobile Transmission. “GOWIN’s FPGA automotive chips featuring high reliability can largely alleviate the severe shortage of such chips faced by domestic auto companies in these applications, and can be responded by local suppliers quickly with quality technical support.”    TP Wang, chief technology officer of GOWIN Semiconductor, said, “It is quite challenging to reach or approach the failure rate of automotive-grade 0 PPM.  Strict industry standards are abided in the entire quality control of automotive chips including designing, manufacturing, packaging and testing. GOWIN planned its process node selection and design accordingly; our FPGAs have passed the automotive certification and have mass production in several different vehicles being actively manufactured. GOWIN has additional automotive-grade FPGAs under certification and will launch additional automotive-grade chips based on more advanced process node next year.”   Shanghai Automobile Transmission (SAGW) is a wholly owned subsidiary of SAIC Motor, with total assets of ¥17.2 billion, annual sales revenue of over ¥10 billion, and annual sales of more than 3.5 million gear assemblies. In recent years, SAGW has accelerated product structure adjustments, especially increased investment in automatic gearing system. Its DCT360 is the first batch-produced dual-clutch automatic gear with fully independent intellectual property rights in China.   As the only high-tech enterprise with both dry and wet dual-clutch automatic gearing systems in China, SAGW has become an OEM supplier and an important strategic partner of emerging vehicles and famous automobile groups at home and abroad such as SAIC Passenger Cars, SAIC-GM, SAIC Volkswagen, SAIC-GM-Wuling, SAIC Maxus, Dongfeng Nissan, Chery Automobile, BAIC Motor, Hezhong Automobile, etc. At present, SAGW is one of the largest Chinese passenger car production and manufacturing enterprises, with the domestic market share of about 15%.
ISP_pressrelease-01
2021-09-20
GOWIN Semiconductor Enables Education and Hobbyists Development Community   SAN JOSE, CA, September 20, 2021 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces a new user community called Magic Jelly Bean.  Magic Jelly Bean focuses on enabling schools, universities, and hobbyists with access to low-cost 3rd party development boards that are shipped locally along with companion example designs and community forums.   MagicJellyBean.org provides up-to-date information on simple and easy-to-use development boards and tutorials currently featuring the MiniStar development kit loaded with  GOWIN’s GW1NS-4C µSoC FPGA.  It also provides references to purchasing sites through domestic distribution vendors such as Amazon, making local shipping very easy.  Community forums on Reddit and Github Discussions provide a discussion and support platform for students, makers, and hobbyists to assist in project development.   “FPGA’s use programming languages similar to C and C++. However, there is a fundamental architectural difference compared to most other programming languages; all code written is executed at the same time instead of sequentially.  This provides a tremendous amount of computing efficiency and flexibility, but also comes with a small learning curve to effectively utilize,” said Grant Jennings, Senior Director of International Marketing for GOWIN Semiconductor.  “Magic Jelly Bean enables engineers of experience levels to learn the capabilities of GOWIN devices with easy-to-use tools and example designs making FPGA development a trivial and second nature exercise.”   MagicJellyBean.org provides student versions of GOWIN EDA and GOWIN MCU Designer that can be easily downloaded and installed without requesting a license file.  The design software is available on Windows and Linux and allows developers to program both GOWIN FPGAs and microprocessors on the development boards available.  Project files are provided on github, allowing for bug reports, updates, additional reference project submissions, and communication related to the Magic Jelly Bean community itself.   MagicJellyBean.org is an independent site featuring innovative FPGA products from GOWIN.  Current and future GOWIN customers can continue to fulfill their production needs through the existing distribution partners including Mouser (https://www.mouser.com/manufacturer/gowin/product-line/), Edge Electronics (www.edgeelectronics.com), and Rutronik (www.rutronik.com).  World-class application and sales support is always available through the website www.gowinsemi.com or by contacting the local sales representatives directly.   “Adding Amazon Store capability to support educational and hobby users is a natural progression and an excellent complement to our existing well established Distributor partners,” said Mike Furnival, Vice President of International Sales at GOWIN Semiconductor. “In these challenging times for global semiconductor supply taking care of smaller, but nonetheless important, potential future customers remains very important for the development of our industry. As these embryonic entities develop they will, in turn, become customers for our Distributors contriving to create a win-win situation for all involved parties.”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp. with sales and R&D locations worldwide, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2021 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com