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GOWIN_GW5AT-15K_Poster_Full
2024-06-24
New low-cost option for high-speed 4K video display interfacing as GOWIN launches small FPGA with hard-core MIPI C-PHY capability   GOWIN GW5AT-15 FPGA combines hard-core PCIe, MIPI D-PHY and MIPI C-PHY interfaces, in-package fast memory and programmable logic to give consumer and automotive applications the ideal mix of high-speed video, small size and low cost   Santa Clara, CA – 25 June 2024 - GOWIN Semiconductor Corporation, the world's fastest-growing FPGA manufacturer, today launched the GW5AT-15 FPGA to provide a programmable high-speed bridging solution for demanding consumer electronics and automotive use cases such as 4K video transfer at high frame rates up to 120 frames/s.   The new GW5AT-15, the latest member of the Arora-V® FPGA family, combines various hard-core SerDes transceivers with high-speed memory and 15,120 logic elements. The product is available in package options including a compact 4.9mm x 5.3mm WLCSP, which offers maximum SerDes throughput of 12.5Gbps.   Arora-V products and the GOWIN EDA development environment can be viewed at GOWIN’s booth 708 at the Sensors Converge Expo (Santa Clara, California, US, 25-26 June 2024).   The features of the GW5AT-15 are ideal for an emerging set of use cases which call for very high bandwidth for video and other data-transfer applications, and which require a small board footprint – examples include consumer tablets, augmented/virtual reality headsets, and car infotainment systems.   The high SerDes bandwidth offered by the GW5AT-15 makes it ideal for use in high-speed interfaces. This new FPGA features:   3-lane MIPI C-PHY operating at up to 5.75Gbps/lane 4-lane PCIe 3.0 4-lane MIPI D-PHY operating at up to 2.5Gbps/lane The GW5AT-15 also supports high-speed USB Type-C® and other USB connections with its on-chip USB 3.x and USB 2.x PHYs. GOWIN’s CEO Jason Zhu said: ‘The market for high-speed display and camera interfaces has been stuck with a choice of high-end FPGAs which are large, expensive and power-hungry, or low-end FPGAs with inadequate SerDes performance. Our latest Arora-V device perfectly fills the gap, offering a unique hard-core MIPI C-PHY and D-PHY capability in a small and highly affordable FPGA.   New use cases include 4K gaming tablets   The high throughput offered by the GW5AT-15 supports gamers’ requirement for high frame-rate 4K video in the latest consumer tablet designs. In vehicle infotainment systems, the GW5AT-15’s provision of high-speed USB and other interfaces enables cars to better emulate the smartphone user experience through applications such as the Android Auto™ or Apple CarPlay® software companions.   All SerDes operations are backed by co-packaged fast memory resources including:   118kb of shadow SRAM 630kb of block SRAM (BSRAM) arranged as 35 x 18kb Optional 64Mb (in MG132P package) or 128Mb (in CM90P package) of pseudo SRAM (pSRAM) Optional 8Mb of NOR Flash The FPGA also features two on-chip PLLs, multiple clock sources, a JPEG codec, and an ADC.   Like the other members of the Arora-V family, the GW5AT-15 is built on a low-power 22nm TSMC process. It is backed by the GOWIN EDA FPGA design environment, which includes an FPGA design tool, IP cores and reference designs. The FPGA design tool supports the SystemVerilog, Verilog and VHDL programming languages. There are no licensing restrictions on the use of GOWIN EDA, and it can be downloaded free from www.gowinsemi.com.   The GW5AT-15 is available for sampling now directly from GOWIN or through any authorized distributor.   About GOWIN Semiconductor Corporation   Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGAs on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN Semiconductor, please visit: https://www.gowinsemi.com/en/   Copyright 2024 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com.   Media Contacts: Andrew Dudaronek andrew@gowinsemi.com   Rhianna Ogle, TKO Marketing Consultants rhianna@tko.co.uk Tel: +44 1444 473555
InfoComm Flyer 2024 Website (2100 × 696 px)
2024-05-09
GOWIN Semiconductor to attend InfoComm 2024   San Jose, United States, and Guangzhou, China 9th May 2024 - GOWIN Semiconductor Corporation, a global leader in FPGA technology and the fastest-growing provider in the industry, is thrilled to announce its debut participation at InfoComm 2024, taking place from June 12th to 14th in Las Vegas, United States. This milestone coincides with GOWIN's tenth anniversary, marking a significant moment in our journey. Join us at booth W1352, where we will unveil our latest FPGA innovations and demonstrate their transformative capabilities.   InfoComm stands as North America's premier audiovisual trade show, uniting manufacturers, integrators, dealers, and end-users worldwide to explore cutting-edge technologies, products, and services. At this esteemed event, we will present our groundbreaking FPGA offerings, notably highlighting the Arora V series. Renowned for their unparalleled SerDes performance and energy efficiency, these devices leverage TSMC’s 22nm LP process with proven automotive grade-1 capability, poised to redefine the mid-density FPGA market. Moreover, our new lineup offers exceptional power efficiency paired with competitive pricing, alongside compatibility with various competitor pin-compatible package options, facilitating seamless integration without PCB hardware redesign.   Our booth will feature live demonstrations showcasing the versatility and power of our FPGA solutions, including MIPI CSI camera to HDMI display bridging utilizing the Arora-V GW5A-25 family, a Universal Audio Class (UAC2) USB2.0 2x2 audio interface powered by the cost-effective LittleBee Flash-based GW1N-9 family, and a captivating beam forming demo.   In a special highlight, we are thrilled to announce that our esteemed CEO, Jason Zhu, will be joining our field sales team to engage in exclusive meetings with invited customers and partners. For those seeking visionary insights into the FPGA industry, this is an unparalleled opportunity to connect with a leader driving innovation.   Scott Casper, Senior Director of Sales, Americas, expressed his enthusiasm, stating, “We are incredibly excited to make our inaugural appearance at InfoComm, presenting our expanding portfolio of products, IP, and pioneering solutions. This event underscores our commitment to leadership in the evolving low and mid-density FPGA landscape.”   GOWIN Semiconductor eagerly anticipates welcoming all prospective customers and partners to booth W1352, where together, we'll explore the boundless possibilities of FPGA technology.   Supporting Resources:   For more information about GOWIN Semiconductor, please visit: https://www.gowinsemi.com/en/ For more information about and to register for the conference, visit https://www.infocommshow.org/   About GOWIN Semiconductor Corporation   Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2024 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com
ISO26262-EN(4)(1)
2024-04-30
GOWIN’s progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment High safety and reliability ratings of the GOWIN mid- and low-density FPGAs prompt automotive OEMs to design them into applications including video bridging, display driving and image signal processing     London, UK and Guangzhou, China - 30 April 2024 - GOWIN Semiconductor Corporation, the world's fastest-growing FPGA manufacturer, today announced that its GOWIN EDA FPGA design environment has been certified compliant with the ISO 26262 and IEC 61508 functional safety standards by the TUV testing laboratory.   Certification of the FPGA design tool provides strong assurance to automotive OEMs that module designs featuring a GOWIN Arora-V (mid-density), Arora-II (low-/mid-density) or LittleBee (low-density) FPGA can meet the requirements for system-level functional safety specified in the ISO 26262 and IEC 61508 standards.   The award of functional safety certification is expected to spark a new wave of interest in GOWIN’s FPGAs, which are available in versions qualified to AEC-Q100 Grade 2, with qualification to AEC-Q100 Grade 1 pending. Existing quality and reliability certificates applicable to the GOWIN product range include IATF16949, ISO 9001, ISO 14001 and ISO/IEC 17025. Thanks to a superior feature set – including a wider range of high-speed video, display and graphics interfaces than other FPGAs in the same segment of the market – and a strong reliability record for devices fabricated on TSMC’s 22nm LP process, GOWIN FPGAs are already used in vehicles for applications such as:   Video bridging and local display dimming in infotainment systems Image signal processing of camera outputs in advanced driver assistance systems (ADAS) USB audio interfacing Display monitoring and safety back-up in the instrument cluster GOWIN’s CEO Jason Zhu said: ‘GOWIN is attracting growing interest in the automotive industry because of its innovations in FPGA design in the low- and mid-density segments. Notably, we uniquely provide hardcore MIPI interfaces in FPGAs alongside DDR3 memory and high-speed LVDS and PCIe interfaces.'   ‘With the award of functional safety certification for our popular GOWIN EDA development environment, we are confident in our ability to make further inroads into the automotive markets in Europe, North America and Asia.’   The GOWIN EDA FPGA design environment includes an FPGA design tool, IP cores and reference designs. The FPGA design tool supports the SystemVerilog, Verilog and VHDL programming languages. There are no licensing restrictions on the use of GOWIN EDA, and it can be downloaded free from www.gowinsemi.com.   GOWIN’s automotive-qualified FPGA product range and the GOWIN EDA development environment can be viewed at its stand 3A.340 at Embedded World (Nuremberg, Germany, 9-11 April 2024).   About GOWIN Semiconductor Corporation   Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGAs on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN Semiconductor, please visit: https://www.gowinsemi.com/en/   Copyright 2024 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com.   Media Contacts: Andrew Dudaronek andrew@gowinsemi.com   Rhianna Ogle, TKO Marketing Consultants rhianna@tko.co.uk
Embedded World Flyer 2024 Website (2100 × 696 px)
2024-03-13
GOWIN Semiconductor to attend Embedded World 2024   London, UK and Guangzhou, China 13th March 2024 - GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA provider, is set to participate in Embedded World 2024 from April 9th to 11th in Nuremberg, Germany. This will be our fourth consecutive appearance at the EW exhibition and coincides with GOWIN’s tenth anniversary year. Our home for this year’s event will be Hall 3A Stand 340 where we will be showcasing and demonstrating our latest FPGA technology.   Embedded World, hosted annually in Germany, stands as Europe's premier trade show for embedded solutions and technologies. Boasting over 1000 exhibitors, it ranks among the world's largest fairs dedicated to cutting-edge embedded technologies for IoT and related market segments.   Following significant automotive success in Asia, GOWIN will continue focusing on the European automotive market this year. We will showcase our latest FPGA offerings, including our new Arora V series devices, celebrated for their exceptional SerDes performance, and energy efficiency. Utilizing TSMC’s 22nm  LP process with proven automotive grade-1 capability, this new lineup is primed to make a significant impression on the mid density FPGA market. In addition to featuring industry-leading power efficiency with very competitive pricing,  this new device family is also available in a range of competitor pin-compatible package options, enabling customers to explore replacement options without redesigning their PCB hardware.   Stand demos this year will include MIPI CSI camera to HDMI display bridging using our new Arora-V GW5A-25 family, Universal Audio Class (UAC2) USB2.0 2x2 audio interface using our low-cost LittleBee Flash-based GW1N-9 family, a AE350 hardcore RISC-V demo using our latest Arora-V GW5AST-138 µSoC FPGA and Field Oriented Motor Control (FOC) using our mid-range Arora-2 family devices.   Finally, we are delighted to announce our field sales team will be accompanied by Jason Zhu, CEO of GOWIN, who will be conducting meetings with invited customers and partners. Please contact us if you are interested in scheduling time with a FPGA industry visionary.   “We are extremely excited to be once again participating at Embedded World in Nuremberg, Germany, showcasing our growing portfolio of products, IP, and innovative solutions.” said Mike Furnival, Vice President of International Sales. “Additionally, to have our CEO, Jason Zhu, joining us clearly illustrates the importance of our global sales efforts and resultant customer relationships. We believe that participation at this show will further cement our position as the true leader in the much changed low and mid density FPGA marketplace”.   GOWIN Semiconductor looks forward to welcoming all interested potential customers and partners to our booth in Hall 3A Stand 340.   Supporting Resources:   To schedule a meeting with GOWIN Semiconductor at Embedded World 2024, please fill out this Google Form here: https://docs.google.com/forms/d/e/1FAIpQLSfsROeh2n92rf3VWtl6-BBWNPMaem2aDyPBfHJSrHRnQ9FhDQ/viewform For more information about GOWIN Semiconductor, please visit: https://www.gowinsemi.com/en/ For more information about and to register for the conference, visit https://www.embedded-world.de/en About GOWIN Semiconductor Corporation Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2024 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com
GOWIN Arora V Expansion website pic
2023-11-01
GOWIN Semiconductor Corporation Expands its Arora V FPGA Family with Advanced Features   San Jose, California and Guangzhou, China, November 1, 2023 - GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA company, is excited to announce an expansion of its Arora V high-performance FPGA family. The latest offering leverages cutting-edge 22nm SRAM technology, 12.5Gbps high-speed SerDes interfaces, PCIe hardcore, MIPI hardcore D-phy and C-phy support, RISC-V microprocessor, and DDR3 interfaces. The extended family now includes 15K, 45K, 60K, and 75K LUT device offerings.   The new Arora V family not only complements the previous Arora family but also offers a significant performance boost with lower power consumption. Specifically, the Arora V devices exhibit 30% higher performance and a remarkable 60% reduction in power consumption compared to the Arora GW2A family. Arora-V programming configuration provides designers with a wide array of options including JTAG, SSPI, MSPI, CPU, and the ability to directly program external SPI Flash in JTAG or SSPI Mode. In addition, it allows for indirect programming of external Flash in other modes using a soft-core IP bridge and supports background upgrades, bitstream file encryption, and security bit settings.   Arora V further distinguishes itself by delivering exceptional Single Event Upset (SEU) resiliency compared to competitors. GOWIN has adopted an innovative approach by designing custom SRAM cells, significantly reducing soft error rate effects. To make the handling of SEU-related matters more accessible, GOWIN provides a "SEU Handler" wrapper IP, which allows users to seamlessly access SEU reports and correction functions, enhancing both reliability and efficiency.   The new Arora V family also incorporates an advanced I/O structure capable of recovering received serial data containing an embedded clock using built-in CDR technology at each differential I/O pair. This feature facilitates easy cascading of multiple GPIOs for achieving high data throughput, all without the need for a SERDES-based solution.   Solutions such as Ethernet, Industrial Field Buses, and LVDS Bus Applications to name a few, can easily be implemented using EasyCDR.   “We are excited to be offering our latest 22nm technology products for next-generation applications during our innovation phase of growth,” states Scott Casper, Director of Sales, GOWIN Semiconductor, “The improvement in performance and speed as well as the added feature of EasyCDR will take us into solutions not realized by previous families.”    For more information about GOWIN, please visit www.gowinsemi.com   About GOWIN Semiconductor Corp.   Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com
GW1NZ2 Promo Pic
2023-10-16
GOWIN Semiconductor Expands its GW1NZ Series of Low-Cost, Small-Size, and Low-Power Devices San Jose, California and Guangzhou, China, October 16, 2023 - GOWIN Semiconductor Corporation, the world’s fastest-growing FPGA company, announces today the expansion of their GW1NZ series of low-cost, small size, and low-power devices. GOWIN is introducing the new GW1NZ-ZV2 product as well as additional package offerings for the GW1NZ-LV/ZV1 products.  The aim of this introduction is to cater to the previously underserved market demand for compact amounts of programmable logic in small packages that can be seamlessly integrated into cost-sensitive and low power applications. In a design space where innovation is limited by cost, size, and power considerations, GOWIN is taking the lead in enabling the utilization of FPGAs. This encompasses domains like high-volume consumer markets and IoT applications, where GOWIN is pioneering the provision of exceptionally affordable and energy-efficient devices. “This new generation of GW1NZ series devices is an important milestone in GOWIN Semiconductor’s development,” said Jason Zhu, CEO, of GOWIN Semiconductor FPGA, “The new GW1NZ series presents a revolutionary cost advantage over competing alternatives, even non-FPGA designs. These devices effectively curtail overall board and system expenditures through unparalleled integration.”   The GW1NZ-ZV2 is a 2K LUT device being offered in CS100 and QFN48 packages with more to come.  Additionally, the GW1NZ-ZV2 is enabled to utilize GOWIN’s GoConfig IP, a programming technology enabling not only standard JTAG programming but other protocols including I2C and SPI. This gives embedded designers more protocol options to program the devices.   The GW1NZ-ZV/LV1 series is adding 2 new low-cost packages to its existing lineup – BGA25 and QFN24.  These are in addition to the small size CSP16 and QFN32 already in production today.  And the GW1NZ-LV/ZV1 is upgraded to support GOWIN’s GoConfig multiprotocol programming IP in select packages.   At its core, our innovation focuses on a low-cost, small size, and low-power FPGAs fortified with remarkably versatile configuration interfaces:   The standby power can be minimized to an impressive 28uW GW1NZ-2 devices include MIPI D-phy and C-phy IP interfaces for camera and display interfacing A library of reference designs available to jump start design efforts for quicker time to market “Our endeavors culminate in a cutting-edge FPGA solution that not only meets stringent cost and power efficiency requirements but also champions unparalleled configuration adaptability through a variety of interfaces,” said Mike Furnival, VP of International Sales of GOWIN Semiconductor FPGA, “Embedded design engineers will find our easy to use GW1NZ series of devices great for their IoT, wearable, and consumer products.”   Volume pricing for the GW1NZ devices can be lower than $0.50.  Please contact your local salesperson for more information. For more information about GOWIN, please visit www.gowinsemi.com   About GOWIN Semiconductor Corp.   Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek
Andes GOWIN PR
2023-08-28
GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA GOWIN Is Offering the Andes A25 RISC-V CPU IP and AE350 Subsystem As Instantiated Hard Cores in Its GW5AST-138 FPGA   [San Jose, Aug. 29, 2023] - Andes Technology Corporation (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, is thrilled to announce that its AndesCore™ A25 RISC-V CPU IP and AE350 peripheral subsystem is hardened and embedded in the GW5AST-138 FPGA chip from GOWIN Semiconductor, the world’s fastest growing FPGA company. This integration, one of the first complete RISC-V microcontrollers in an FPGA, provides designers the A25 processor power and the peripherals most processors require without consuming any FPGA resources. Thus, the hardware team can populate the FPGA with their value-added design while the software team can concurrently create application code based on the rich RISC-V ecosystem.   “Andes is committed to delivering cutting-edge RISC-V technologies allowing developers to create innovative and efficient solutions. The integration of the A25 RISC-V CPU and AE350 peripheral subsystem as a hard core in GOWIN Semiconductor’s GW5AST-138 FPGA marks a significant milestone in achieving this vision,” said Andes North America VP of Sales, Vivien Lin.  “This represents a significant milestone for the RISC-V architecture as it provides our joint customers a versatile hardware development platform to create, debug, and verify their ultimate SoC design before committing their netlist for silicon fabrication. For customers not requiring an SoC, it will enable a complete RISC-V computer ready to drive their end applications.”   "In the Arora V family, we incorporate the peripherals that a RISC-V CPU typically requires in hard instantiations," says GOWIN’s Sr. Director of Solution Development, Jim Gao. “We included a fully controllable high-speed SerDes for communication, video aggregation, and AI computing acceleration applications that demand very high data rates. Other instantiated functions include Block RAM modules supporting ECC error correction, high-performance multiple voltage GPIO, and high accuracy clock architecture. These hard functions save the FPGA programmable fabric of up 138K LUT’s for the designers’ unique logic implementation."     About the RISC-V Based GW5AST-138 FPGA:   The AndesCore™ A25 hard core, running at 400MHz, supports the RISC-V P-extension DSP/SIMD ISA (draft), single- and double-precision floating point and bit-manipulation instructions, and MMU for Linux based applications. The AE350 AXI/AHB-based platform comes with level-one memories, interrupt controller, debug module, AXI and AHB Bus Matrix Controller, AXI-to-AHB Bridge and a collection of fundamental AHB/APB bus IP components pre-integrated together as a system design. DDR3 controller and SPI-Flash controller in the FPGA fabric back up the A25's 32KByte I-Cache and D-Cache after cache misses. Off chip DDR3 provides data memory, SPI-Flash contains the A25's instruction memory (codes copied from SPI-Flash into DDR3 and Cache upon boot-up).  Besides hard instantiated functions, the GOWIN GW5AST-138 FPGA fabric affords 138K LUTs for custom design implementation.  GOWIN EDA provides an easy-to-use FPGA hardware development environment for the Arora V.  The environment supports multiple RTL-based programming languages, synthesis, placement and routing, bitstream generation and download, power analysis and in-device logic analyzer.   Price & Availability   The GW5AST-138 FPGA with SDK with GOWIN_V1.9.9 Beta-3 will be available August 18 through distribution.   About GOWIN Semiconductor Corp.   Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   About Andes Technology   Eighteen years in business and a Founding Premier member of RISC-V International, Andes is a publicly listed company (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), a leading supplier of high-performance/ low-power 32/64-bit embedded processor IP solutions, and the driving force in taking RISC-V mainstream. Its V5 RISC-V CPU families range from tiny 32-bit cores to advanced 64-bit Out-of-Order processors with DSP, FPU, Vector, Linux, superscalar, and/or multi/many-core capabilities. By the end of 2022, the cumulative volume of Andes-Embedded™ SoCs has surpassed 12 billion.   For more information, please visit https://www.andestech.com. Follow Andes on LinkedIn, Twitter, Bilibili and YouTube!     Media Contact: Andrew Dudaronek andrew@gowinsemi.com
Embedded World Flyer 2023 P3 (2100 × 696 px)
2023-03-06
GOWIN Semiconductor to attend Embedded World 2023   London, UK and Guangzhou, China 7th March 2023 - GOWIN Semiconductor Corporation, the world’s fastest-growing FPGA provider, will attend Embedded World 2023 on 14th-16th of March in Nuremberg, Germany. This will be the third time GOWIN has had its own stand (Hall 3A Stand 340) at Embedded World to showcase and demonstrate our latest FPGA technology to the European market.   Embedded World, held annually in Germany, is Europe’s leading trade show for all embedded solutions and technologies. With over 1000 exhibitors it is one of the world’s largest fairs focussing exclusively on state-of-the-art embedded technologies for IoT and related market spaces.   This year GOWIN will be showcasing and demonstrating, amongst other things, our new Arora-V family of high density, high performance, and low power FPGA. Built on a highly optimized TSMC 22nm process this family will compete fiercely with similar competitive FPGA devices by offering not just the lowest power and prices but also pin-compatible footprint options that will offer customers real alternatives without changing their PCB layout.   Also on the stand will be demonstrations of our latest USB offerings which include for the first time a fully integrated FPGA based solution supporting high resolution UAC (USB Audio Class) 2.0 with integrated soft PHY and controller. Additionally, there will be various demos showcasing display and camera solutions.   Lastly, we are very pleased that, for the first time, the sales and technical team will be joined on our stand, by Jason Zhu, GOWIN CEO, who will be hosting various meetings with invited customers and partners. Let us know if you would like to spend some time with an FPGA industry visionary.   “We are immensely proud to be exhibiting again at Embedded World, and to have Jason joining us.” said Mike Furnival, Vice President of International Sales. “It speaks volumes to the progress that we have made during the past year in terms of differentiated as well as pin-compatible FPGA solutions. Whilst we continue to be the lowest cost provider of low and mid density FPGA devices, we are now in the high-density FPGA world and have emerged as one the most innovative in terms of advanced solutions in the marketplace, adding significant value to our customers and partners.”   GOWIN Semiconductor looks forward to welcoming all interested potential customers and partners to our booth in Hall 3A Stand 340.   About GOWIN Semiconductor Corporation   Founded in 2014, GOWIN Semiconductor Corp. with sales and R&D locations worldwide has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership by using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.    For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com
Jason pic HQ
2023-01-12
Interface Magazine interview with GOWIN's CEO, Jason Zhu   SAN JOSE, Calif. and GUANGZHOU, China, January. 12, 2023 GOWIN's CEO Jason Zhu is interviewed by the Interface Editorial Department. Jason goes over GOWIN's recent accomplishments and what is in store for 2023.    What kind of company is GOWIN Semiconductor?   GOWIN was established in 2014 and I believe the company's value lies in its awareness of how to develop products that customers need to go directly into the market.   What kind of products are you developing?   Embedded Flash type small FPGA (LittleBee family) mounted on Tang nano board (Sipeed) and higher-grade basic SRAM type FPGA (Arora family). Each of them has a unique product development that is unique from other companies due to implementing additional memory such as pSRAM and SDRAM. We have also developed a USB soft PHY IP which is not found in other companies. In response to market demands, the LittleBee family provides devices with enhanced security functions and devices equipped with Arm Cortex-M3. We always start with the creation of products with the user in mind and provide various types of support along the road to development.   What is the corporate culture at GOWIN?   When looking at GOWIN from the business and corporate culture aspects, we strive to emphasize creativity.  For example, supporting the Tang Nano on the business side hardly contributes to sales, but we enjoy seeing veteran designers and new hobbyists using the platform to create something new. We would like to expand the base for products like Tang Nano to be used in education and hobby. If a product that is especially easy for young people to use enters the market, GOWIN will eventually be known as a company that supports Tang Nano. I think that supporting creative communities within the space is important for that purpose.   How is business going?   Since its establishment, the total number of shipments has exceeded 50 million. Starting from the Chinese market, sales have increased tenfold in markets other than China (as of 2021). GOWIN's main target market is industry with in-vehicle automotive being second. In-vehicle sales are mainly in China, and we would like to work in Japan in the future. With the spread of EVs, GOWIN has become the No. 1 supplier of FPGAs in China. GOWIN devices are mainly manufactured at TSMC's fab (semiconductor manufacturing facility) in Taiwan. LittleBee and Arora have a process rule of 55nm. The new Arora V we recently announced also uses TSMC's 22nm. We have already acquired AEC-Q100 (in-vehicle standard), but we are planning to acquire functional safety ISO26262 next year.   What is your future road map? We are focusing on future product development in 2023. The ES of the Arora V 60K LUT product will be announced in the 2Q of 2023. In parallel with this, the development of the Arora 7 series is underway. We are also considering cloud and data centers in the market, but our policy is to continue with industry as the focus. Currently, there are more cases where users cannot obtain parts or have difficulty grasping the future roadmap. GOWIN will continue to introduce products to the industrial market to solve such problems.   Could you tell us the position of the Japanese market, or rather, tell us about the top five countries in terms of sales, including China, and give us an approximate ratio?   GOWIN attaches great importance to the Japanese market. We focus on what makes the Japanese market unique and different from other countries. Market sales are divided into four regions. 1st China, 2nd Asia Pacific (including Japan, excluding China), 3rd America (including Canada), 4th EU (including Africa and the Middle East), China 55%, non-China 45%. I mentioned earlier that sales outside of China are growing more than 10 times higher, but domestic sales in China are also growing significantly. Due to supply chain problems and changes in the markets that our competitors were focusing on, we were able to enter markets that we could not previously touch.   Will demand for FPGA package standards such as QFP and BGA take precedence? Please explain how the creators make decisions.   Packages are driven by market needs. For the maker community, I don't like BGA. Debugging is difficult and expensive, and it is difficult for the user to check whether it is properly implemented. However, we supply BGA for users who need space-saving and more I/O. It is easier for GOWIN to distribute QFN and QFP. Even with a single lead frame for a BGA, each PCB in the chip must be custom-made. A general-purpose package can use a general-purpose lead frame. The number of pins is about 88 at maximum for QFN and at least 100 for QFP. Optimization for space issues and I/O count is something we can finally address.