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Solder Ball Change for CSP72 Package Products |
PCN |
GPCN-2025-003 |
|
2025/06/26 |
PDF |
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Packging Method Change for VFBGA(3.8×3.8-0.5)0049 Package Products |
PCN |
GPCN-2025-002 |
|
2025/06/26 |
PDF |
|
GPCN-2025-DP005_DK_USB_GW5AT-LV60UG225_V1.1 |
User Guide |
|
1.0J |
2025/06/20 |
PDF |
|
DK_USB_GW5AT-LV60UG225_V1.1 Product Changement Notice |
PCN |
EN-GPCN-2025-DP005 |
|
2025/06/19 |
PDF |
|
Gowin DDR2 PHY Interface IP User Guide |
User Guide |
IPUG1183 |
1.1J |
2025/06/13 |
PDF |
|
Gowin DC-SCM LTPI IP User Guide |
User Guide |
IPUG1086 |
1.0.1J |
2025/06/13 |
PDF |
|
Gowin Flash Controller User Guide |
User Guide |
IPUG901 |
1.8.5J |
2025/06/13 |
PDF |
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Gowin HyperRAM Memory Interface RefDesign |
RefDesign |
|
|
2025/06/11 |
ZIP |
|
Gowin UHS PSRAM Memory Interface RefDesign |
RefDesign |
|
|
2025/06/11 |
ZIP |
|
Gowin Integer Division RefDesign |
RefDesign |
|
|
2025/06/11 |
|