|
Package Process Change for GW1N-LV2CS100H |
PCN |
GPCN-2026-007 |
|
13/10/2026 |
PDF |
|
Addition of Second FT Final Test Site – Shenzhen V-test |
PCN |
GPCN-2026-005 |
|
13/10/2026 |
PDF |
|
Addition of Second Source for LQFP144L(2020X1.4) Leadframe |
PCN |
GPCN-2026-002 |
|
13/10/2026 |
PDF |
|
GPCN-2026-003_GW5A-60_GW5AT-60 Series of Products Voltage Range Change |
PCN |
GPCN-2026-003 |
|
09/06/2026 |
PDF |
|
GPCN-2026-001 GW1NZ-1 Series of Products Version Upgraded.pdf |
PCN |
GPCN-2026-001 |
|
12/05/2026 |
PDF |
|
GPCN-2025-005_Second Supplier Added for 0402 1uF Capacitor |
PCN |
GPCN-2025-005 |
|
28/01/2026 |
PDF |
|
Addition of Second Source for Package Material – Polyimide (PI) |
PCN |
GPCN-2025-006 |
|
16/12/2025 |
PDF |
|
GW5ART-LV15CM90PFC1 Package Design Change |
PCN |
GPCN-2025-004 |
|
21/07/2025 |
PDF |
|
Solder Ball Change for CSP72 Package Products |
PCN |
GPCN-2025-003 |
|
26/06/2025 |
PDF |
|
Packging Method Change for VFBGA(3.8×3.8-0.5)0049 Package Products |
PCN |
GPCN-2025-002 |
|
26/06/2025 |
PDF |