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GPCN-2024-007_Molding Compound Change for GW2A-LV55UG676_GW2AN-LV55UG676 |
PCN |
GPCN-2024-007 |
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2025/01/02 |
PDF |
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GPCN-2024-006_Test site V-Test (Shenzhen) added |
PCN |
GPCN-2024-006 |
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2025/03/10 |
PDF |
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GPCN-2024-005 GW5A-60/GW5AT-60 series of Products Upgraded |
PCN |
GPCN-2024-005 |
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2024/12/16 |
|
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GPCN-2024-001_Product Shelf Life Change |
PCN |
GPCN-2024-001 |
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2024/03/28 |
PDF |
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GPCN-2023-004_Henkle DAF Change |
PCN |
GPCN-2023-004 |
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2024/03/25 |
PDF |
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GPCN-2023-003_A Second supplier of QFN(04040.75-0.40)032 leadframe added |
PCN |
GPCN-2023-003 |
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2023/09/18 |
PDF |
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GPCN-2023-002_GW2A-LV18EQ144 Die Thickness (After grinding) Change |
PCN |
GPCN-2023-002 |
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2023/09/18 |
PDF |
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GPCN-2023-001_Tray packing method change |
PCN |
GPCN-2023-001 |
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2023/02/17 |
PDF |
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GPCN-2022-006_Change of PBGA256 package products molding compound material |
PCN |
GPCN-2022-006 |
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2022/11/21 |
PDF |
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GPCN-2022-005_Change of GW2A-LV18MG196 Wirebonding Material |
PCN |
GPCN-2022-005 |
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2022/11/21 |
PDF |