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GPCN-2019-005_GW2A(R)-18 add Device GW2A(R)-18C |
PCN |
GPCN-2019-005 |
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2022/11/09 |
PDF |
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GPCN-2019-004_Product Marking Change |
PCN |
GPCN-2019-004 |
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2022/11/09 |
PDF |
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GPCN-2022-006_Change of PBGA256 package products molding compound material |
PCN |
GPCN-2022-006 |
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2022/11/21 |
PDF |
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GPCN-2022-005_Change of GW2A-LV18MG196 Wirebonding Material |
PCN |
GPCN-2022-005 |
|
2022/11/21 |
PDF |
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GPCN-2023-001_Tray packing method change |
PCN |
GPCN-2023-001 |
|
2023/02/17 |
PDF |
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GPCN-2023-003_A Second supplier of QFN(04040.75-0.40)032 leadframe added |
PCN |
GPCN-2023-003 |
|
2023/09/18 |
PDF |
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GPCN-2023-002_GW2A-LV18EQ144 Die Thickness (After grinding) Change |
PCN |
GPCN-2023-002 |
|
2023/09/18 |
PDF |
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GPCN-2021-006_GW1N(R) LV4 series product version upgrade |
PCN |
GPCN-2021-006 |
|
2023/09/18 |
PDF |
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GPCN-2021-005_GW1N(R) UV4 series product version upgrade |
PCN |
GPCN-2021-005 |
|
2023/09/18 |
PDF |
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GPCN-2023-004_Henkle DAF Change |
PCN |
GPCN-2023-004 |
|
2024/03/25 |
PDF |