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GPCN-2023-002_GW2A-LV18EQ144 Die Thickness (After grinding) Change |
PCN |
GPCN-2023-002 |
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2023/09/18 |
PDF |
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GPCN-2023-001_Tray packing method change |
PCN |
GPCN-2023-001 |
|
2023/02/17 |
PDF |
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GPCN-2022-006_Change of PBGA256 package products molding compound material |
PCN |
GPCN-2022-006 |
|
2022/11/21 |
PDF |
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GPCN-2022-005_Change of GW2A-LV18MG196 Wirebonding Material |
PCN |
GPCN-2022-005 |
|
2022/11/21 |
PDF |
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GPCN-2022-004_Tray packing method change to add EPE foam |
PCN |
GPCN-2022-004 |
|
2022/11/09 |
PDF |
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GPCN-2022-003_PN change of GW1N-2K and GW1N-1P5 series products |
PCN |
GPCN-2022-003 |
|
2022/11/09 |
PDF |
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GPCN-2022-002_GW1N-2 and GW1N-1P5 series product version upgrade |
PCN |
GPCN-2022-002 |
|
2022/11/09 |
PDF |
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GPCN-2022-001_GW1N-LV4QN88A4 device version upgrade |
PCN |
GPCN-2022-001 |
|
2022/11/09 |
PDF |
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GPCN-2021-007_GW1N-2 and GW1N-1P5 series product version upgrade |
PCN |
GPCN-2021-007 |
|
2022/11/09 |
PDF |
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GPCN-2021-006_GW1N(R) LV4 series product version upgrade |
PCN |
GPCN-2021-006 |
|
2023/09/18 |
PDF |