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GPCN-2025-005_Second Supplier Added for 0402 1uF Capacitor |
PCN |
GPCN-2025-005 |
|
2026/01/28 |
PDF |
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Addition of Second Source for Package Material – Polyimide (PI) |
PCN |
GPCN-2025-006 |
|
2025/12/16 |
PDF |
|
GW1N-LV2LQ144F Product Discontinuation |
PDN |
GPDN-2025-001 |
|
2025/10/21 |
PDF |
|
Gowin Development Kit and Programmer Label Instructions |
PCN |
GDPS-2025-003 |
|
2025/11/27 |
PDF |
|
DK_START_GW5AT-LV60PG484A_V1.2 Product Changement Notice |
PCN |
EN-GPCN-2025-DP006 |
|
2025/08/14 |
PDF |
|
Gowin Development Kit and Programmer Information System |
|
GDPS-2025-002 |
|
2025/08/04 |
PDF |
|
Gowin Development Kit and Programmer Quality Commitment |
|
GDPS-2025-001 |
|
2025/08/04 |
PDF |
|
GW5ART-LV15CM90PFC1 Package Design Change |
PCN |
GPCN-2025-004 |
|
2025/07/21 |
PDF |
|
Solder Ball Change for CSP72 Package Products |
PCN |
GPCN-2025-003 |
|
2025/06/26 |
PDF |
|
Packging Method Change for VFBGA(3.8×3.8-0.5)0049 Package Products |
PCN |
GPCN-2025-002 |
|
2025/06/26 |
PDF |