(Traditional FPGA) GW1NR
(Integrated RAM) GW1NS
(ARM Cortex-M3) GW1NSE(R)
(Security) GW1NRF
(Bluetooth LE) GW1NZ
(Ultra Low Power) GW1N-A
(Automotive) GW1NSR
(ARM+RAM) Documentation
GOWIN’s LittleBee® product family offers flash based, non-volatile FPGAs with an abundance of logic resources, multiple IO standards, embedded RAM, DSPs, PLLs, embedded security and additional user flash while being optimized for low power, low cost and small footprint applications requiring instant-on, high IO count, high throughput and low latency programmable computing.
As a result, LittleBee® FPGAs are leading the industry in I/O intensive source synchronous interfacing and bridging applications such as MIPI CSI-2, MIPI DSI, USB 2.0, Ethernet, HDMI, MIPI I3C and more. They are also an ideal candidate for hardware management applications offering instant-on booting and built-in security functions.
The LittleBee® FPGA family is complimented by multiple innovative product line sub-features such as extended memory, hardened ARM Cortex-M processor cores, security and Bluetooth LE expanding its capabilities and usage compared to traditional FPGA products.
GOWIN Semiconductor also provides highly optimized and easy to use FPGA development software supporting the LittleBee® product family including synthesis, mapping, placement, routing and bitstream generation along with programming tools, embedded logic analyzer, and power calculator.
LittleBee FPGA Product Features:
-
- Small Form Factor
-As small as 2.3x2.4mm2
-
- Embedded Flash
-Bitstream
-User
-
- Extensive Pipeline Computing Resources
-Higher DSP Ratio
-Higher RAM Ratio
-
- Flexible Programming Interface
-JTAG, MSPI, SSPI, I2C, CPU
-Multi-Boot
-
- Serialized Interface Support
-MIPI CSI-2, MIPI DSI, LVDS, HDMI
-USB 2.0, PCI, Ethernet
-DDR3, HyperRAM, PSRAM
-
- Embedded Security
- Bitstream Encryption
- Device Locking
-
- Extension Features
- Integrated PSRAM
-Hardened ARM Cortex-M3 and Synopsys ARC MCU Cores
-Bluetooth Low Energy Transceiver
-PUF Based Asynchronous Application Security
-AEC-100Q Automotive Qualified
GW1N Series Table
Device | GW1N-1P5 | GW1N-2 | GW1N-4 | GW1N-9 |
LUT4 | 1,584 | 2,304 | 4,608 | 8,640 |
Flip-Flop (FF) | 1,584 | 2016 | 3,456 | 6,480 |
Shadow SRAM Capacity(bits) | 12K | 18K | 0 | 16K |
Block SRAM Capacity(bits) | 72K | 72K | 180K | 468K |
Number of BSRAM | 4 | 4 | 10 | 26 |
User Flash (bits) | 96K | 96K | 256K | 608K |
18 x18 multiplier | 0 | 0 | 16 | 20 |
PLLs | 1 | 1 | 2 | 2 |
Total Number of I/O Banks | 6 | 6 | 4 | 4 |
Max. GPIOs | 125 | 125 | 218 | 276 |
Core Voltage Typ. (LV) | 1.2V | 1.2V | 1.2V | 1.2V |
Core Voltage Typ. (UV) |
1.8V-3.3V |
1.8V-3.3V |
2.5V-3.3V | 2.5V-3.3V |
Package Options, Available User I/O, (and LVDS Pairs):
GW1N-1GW1N-1S
Package | Pitch (mm) | Size (mm) | GW1N-1P5 | GW1N-2 | GW1N-4 | GW1N-9 | Identifier |
QN32 |
0.5 |
5 x 5 |
- |
21 (1) |
24(3) |
- |
|
QN32X |
0.5 |
5 x 5 |
- |
21 (1) |
- |
- |
X |
FN32 |
0.4 |
4 x 4 |
- |
- |
- |
- |
|
CS42 |
0.4 |
2.4 x 2.9 |
|
24 (7) |
- |
- |
|
CS42H |
0.4 |
2.4 x 2.9 |
- |
21(3) |
- |
- |
H |
QN48 |
0.4 |
6 x 6 |
|
41(12) |
40(9) |
40(12) |
|
QN48H |
0.4 |
6 x 6 |
|
31(8) |
- |
- |
H |
QN48F |
0.4 |
6 x 6 |
|
- |
- |
40(11) |
F |
QN48X |
0.5 |
7 x 7 |
39(10) |
- |
- |
- |
X |
QN48XF |
0.5 |
7 x 7 |
40(11) |
- |
- |
- |
XF |
CM64 |
0.5 |
4.1 x 4.1 |
|
|
- |
55(16) |
|
CS72 |
0.4 |
3.6 x 3.3 |
58(19) |
- |
|
||
CS81M |
0.4 |
4.1 x 4.1 |
|
|
- |
55(15) |
M |
QN88 |
0.4 |
10 x 10 |
- |
58(17) |
71(11) |
71(19) |
|
CS100H |
0.4 |
4 x 4 |
- |
79 (21) |
- |
- |
H |
LQ100 |
0.5 |
14 x 14 |
80(16) |
80(15) |
80(13) |
80(20) |
|
LQ100X |
0.5 |
14 x 14 |
80(16) |
80(15) |
- |
- |
X |
LQ144 |
0.5 |
20 x 20 |
- |
113(28) |
120(22) |
121(28) |
|
LQ144X |
0.5 |
20 x 20
|
- |
113(28) |
- |
- |
X |
LQ144F |
0.5 |
20 x 20 |
- |
115 (27) |
- |
- |
F |
EQ144 |
0.5 |
20 x 20 |
- |
- |
- |
121(28) |
|
MG49 |
0.5 |
3.8 x 3.8 |
- |
42(11) |
- |
- |
|
MG100 |
0.5 |
5 x 5 |
- |
- |
- |
87(25) |
|
MG100T |
0.5 |
5 x 5 |
- |
- |
- |
87(17) |
T |
MG121 |
0.5 |
6 x 6 |
- |
100(28) |
- |
- |
|
MG121X |
0.5 |
6 x 6 |
- |
100(28) |
- |
- |
X |
MG132 |
0.5 |
8 x 8 |
- |
104(29) |
- |
- |
|
MG132H |
0.5 |
8 x 8 |
- |
95(29) |
- |
- |
H |
MG132X |
0.5 |
8 x 8 |
- |
104(29) |
105(23) |
- |
X |
MG160 |
0.5 |
8 x 8 |
- |
- |
132 (25) |
132(38) |
|
UG169 |
0.8 |
11 x 11 |
- |
- |
129 (27) |
129(38) |
M |
LQ176 |
0.4 |
20 x 20 |
- |
- |
- |
147(37) |
|
EQ176 |
0.4 |
20 x 20 |
- |
- |
- |
148(37) |
|
MG196 |
0.5 |
8 x 8 |
- |
- |
- |
113(35) |
|
PG256 |
1.0 |
17 x 17 |
- |
- |
208(32) |
208(36) |
|
PG256M |
1.0 |
17 x 17 |
- |
- |
208(32) |
- |
M |
UG256 |
0.8 |
14 x 14 |
- |
- |
- |
207(36) |
|
UG332 |
0.8 |
17 x 17 |
- |
- |
- |
274(43) |
|
GW1N-1S
Note!
-
JTAGSEL_N and JTAG pins cannot be used as GPIOs simultaneously. However, when mode [2:0] = 001, the JTAGSEL_N pin is always a GPIO, in other words the JTAGSEL_N pin and the four JTAG pins (TCK, TMS, TDI, TDO) can be used as GPIOs simultaneously. See UG103, GW1N series of FPGA Products Package and Pinout for further information
- GW1N-1P5 & GW1N-2 device: When Mode[2:0] = I2C (3'b100), the loading rate at which the bitstream is transferred from Flash to SRAM is fixed at 2.5MHz, this may extend the device configuration time
- For GW1N-4/GW1N-9 UV version devices, if Vcc and Vccx share a pin in a package, the Vccx range (2.5V~3.3V) of GW1N-4/GW1N-9 will limit the Vcc range to 2.5 V~3.3V, in this case Vcc does not support 1.8V.
Package Identifier Definition Table
Feature identifier table denotes additional device capabilities outside of the traditional FPGA options
H | 10Gbps MIPI D-PHY Hard Core (2.5Gbps/lane x4 data lanes+ Clock lane) |
F | MSPI Programming |
T | MG100T is pin compatible with the GW1NR-MG100PT |
GW1NR Series Table
Device | GW1NR-2 | GW1NR-4 | GW1NR-9 |
LUT4 | 2304 | 4,608 | 8,640 |
Flip-Flop (FF) | 2304 | 3,456 | 6,480 |
ShadowSRAM SSRAM(bits) | 18K | 0 | 16K |
Block SRAM BSRAM(bits) | 72K | 180K | 468K |
Number of BSRAM | 4 | 10 | 26 |
User Flash (bits) | 96K | 256K | 608K |
SDR SDRAM(bits) | - | 64M | 64M |
Embedded PSRAM(bits) | 32-64M | 32-64M | 64-128M |
NOR FLASH (bits) | 4M | - | - |
18 x 18 Multiplier | 0 | 16 | 20 |
PLLs | 1 | 2 | 2 |
I/O Bank Number | 7 | 4 | 4 |
Max. GPIOs | 126 | 218 | 276 |
Core Voltage Typ. (LV) | 1.2V | 1.2V | 1.2V |
Core Voltage Typ. (UV) | 1.8V/2.5V/3.3V | 2.5V/3.3V | - |
Package Options, Available User I/Os, (and LVDS Pairs):
Package | Pitch(mm) | Size(mm) | GW1NR-2 | GW1NR-4 | GW1NR-9 | Identifier |
QN88 | 0.4 | 10 x 10 | - | 70(11) | 70(19) | |
QN88P | 0.4 | 10 x 10 | - | 70(11) | 70(17) | P |
MG49P | 0.5 | 3.8 x 3.8 | 30(8) | - | - | P |
MG49PG | 0.5 | 3.8 x 3.8 | 30(8) | - | - | PG |
MG49G | 0.5 | 3.8 x 3.8 | 30(8) | - | - | G |
MG81P | 0.5 | 4.5 x 4.5 | - | 68(10) | - | P |
MG100P | 0.5 | 5 x 5 | - | - | 87(16) | P |
MG100PF | 0.5 | 5 x 5 | - | - | 87(16) | PF |
MG100PA | 0.5 | 5 x 5 | - | - | 87(17) | PA |
MG100PT | 0.5 | 5 x 5 | - | - | 87(17) | PT |
MG100PS | 0.5 | 5 x 5 | - | - | 87(17) | PS |
LQ144P | 0.5 | 20 x 20 | - | - | 120(20) | P |
Package and Memory Information
Package | Device | Memory | Capacity | Width | Identifier |
QN88 |
GW1NR-4 |
SDR SDRAM |
64M |
16 bits |
|
GW1NR-9 |
SDR SDRAM |
64M |
16 bits |
|
|
QN88P |
GW1NR-4 |
PSRAM |
32M |
8 bits |
P |
GW1NR-9 |
PSRAM |
64M |
16 bits |
P |
|
MG81P |
GW1NR-4 |
PSRAM |
64M |
16 bits |
P |
MG100P |
GW1NR-9 |
PSRAM |
128M |
32 bits |
P |
MG100PF |
GW1NR-9 |
PSRAM |
128M |
32 bits |
PF |
MG100PA |
GW1NR-9 |
PSRAM |
128M |
32 bits |
PA |
MG100PT |
GW1NR-9 |
PSRAM |
64M |
16 bits |
PT |
MG100PS |
GW1NR-9 |
PSRAM |
64M |
16 bits |
PS |
LQ144P |
GW1NR-9 |
PSRAM |
64M |
16 bits |
P |
MG49P |
GW1NR-2 |
PSRAM |
64M |
16 bits |
P |
MG49G |
GW1NR-2 |
NOR FLASH |
4M |
1 bit |
G |
MG49PG |
GW1NR-2 |
PSRAM |
32M (PSRAM) |
8 bits |
PG |
NOR FLASH |
4M (NOR FLASH) |
1 bit |
PG |
Package Identifier Definition Table
Feature identifier table denotes additional device capabilities outside of the traditional FPGA options
P | PSRAM |
PG | PSRAM, Alternative Pinout |
G | Alternative Pinout |
PF | PSRAM, MSPI Programming |
PA | AP memory PSRAM |
PT | Two PSRAM, compatible with GW1NR-LV9MG100P |
PS | Second PSRAM, compatible with GW1NR-LV9MG100PF |
The GW1NR embedded pSRAM memory products allow for more efficiency with onboard memory and high-speed data rates. It has been optimized with Low Power, Small Size, and Thinnest Package in mind.
Features:
- Embedded 64 Mb pSRAM
- Supports 16-bit wide data, up to 166MHz clock rate/332Mbps data speeds
- Small package sizes
- Low power consumption
- Dual Boot FPGA
- Remote upgradeable bitstream
GW1NS Series Table
Parameter | GW1NS-4 | GW1NS-4C |
LUT4 | 4,608 | 4,608 |
FF | 3,456 | 3,456 |
B-SRAM bits | 180K | 180K |
B-SRAM quantity | 10 | 10 |
18 x 18 Multiplier | 16 | 16 |
S-SRAM bits | - | - |
User Flash bits | 256K | - |
PLLs | 2 | 2 |
OSC | 1,+/-5% accuracy | 1,+/-5% accuracy |
Hard Core Processor | - | Cortex-M3 |
I/O Banks | 4 | 4 |
Max. GPIOs | 106 | 106 |
Core Voltage Typ. | 1.2V | 1.2V |
Package Options, Availible User I/O, (and LVDS Pairs):
Package | Pitch(mm) | Size(mm) | GW1NS-4 | GW1NS-4C |
CS49 | 0.4 | 2.9 x 2.9 | 42(8) | 42(8) |
LQ144 | 0.5 | 20 x 20 | - | 82(5) |
MG64 | 0.5 | 4.2 x 4.2 | 55(8) | 55(8) |
QN48 | 0.4 | 6 x 6 | 38(4) | 38(4) |
QN32 | 0.5 | 5 X 5 | 23(1) | - |
Note!
- JTAGSEL_N and JTAG pins cannot be used as GPIOs simultaneously. However, when mode [2:0] = 001, the JTAGSEL_N pin is always a GPIO, in other words the JTAGSEL_N pin and the four JTAG pins (TCK, TMS, TDI, TDO) can be used as GPIOs simultaneously.
The GW1NS FPGA SoC device inherits the innovation of LittleBee™ family with embedded ARM Cortex-M3 hardcore processor, user flash, SRAM read/write controller providing customers all-in-one embedded solution with programable logic features in one chip. With Gowin integrated development environment, engineers can develop their hardware and software in a single platform, which is another innovation of FPGA design platform and reduces engineering design cycle.
Embedded 32-bit RISC Microprocessor
- Arm Cortex-M3 (80 MHz)
- 32KB User Flash
Flash Configuration
- Supports 2 image files
- Supports Dual Boot
- Online Upgradeable
- Remote Upgrade
Integrated Development Flow for both M3 Core and FPGA Programming
- Both the Cortex M3 IDE and GOWIN FPGA programming toolchain are integrated as one
Fixed MIPI D-PHY I/O
- I/O's are fixed to accept GOWIN control logic IP for a fully compliant CSI/DSI solution
GW1NSR Version includes:
- 32M-bits of embedded pSRAM memory
- 8-bit wide, 332Mbps data rates (166 MHz clock)
Real-Time Operating Systems Supported
- uCOSIII
- FreeRTOS
GW1NS Video Training
GW1NSE Secure FPGA Table
Parameter | GW1NS-4C |
LUT4 | 4,608 |
FF | 3,456 |
B-SRAM bits | 180K |
B-SRAM quantity | 10 |
18 x 18 Multiplier | 16 |
S-SRAM bits | - |
User Flash bits | - |
PLLs | 2 |
OSC | 1,+/-5% accuracy |
Hard Core Processor | Cortex-M3 |
I/O Banks | 3 |
Max. GPIOs | 106 |
Core Voltage Typ. | 1.2V |
Package Options, Availible User I/O, (and LVDS Pairs):
Package |
Pitch(mm) | Size(mm) | GW1NSE-4C | GW1NSER-4C | Identifier |
QN48 | 0.4 | 6 x 6 | - | - | |
LQ144 | 0.5 | 20 x 20 | - | - | |
QN48P | 0.4 | 6 x 6 | - | 38(4) | P |
QN48G | 0.4 | 6 x 6 | - | 38(4) | G |
Package Identifier Definition Table
Feature identifier table denotes additional device capabilities outside of the traditional FPGA options
P | PSRAM |
G | Alternative Pinout |
GW1NSE SecureFPGA products provide a Root of Trust based on SRAM PUF technology. Each device is factory provisioned with a unique key pair that is never exposed outside of the device. This widely applicable feature can be used for a variety of consumer and industrial IoT, edge and server management applications.
GW1NRF Series Table
Device | GW1NRF-LV4B |
LUT4 | 4,606 |
Flip-Flop (FF) | 3,456 |
Shadow SRAM SSRAM (bits) | 0 |
Block SRAM BSRAM (bits) | 180K |
Number of BSRAM | 10 |
User Flash (bits) | 256K |
18 x 18 Multiplier | 16 |
PLLs | 2 |
I/O Bank Number | 4 |
Max. User I/O | 25 |
FPGA Core Voltage Typ. (LV) | 1.2V |
FPGA Core Voltage Typ. (UV) | 1.8V/2.5V/3.3V |
Bluetooth 5.0 LE RF | Yes |
32-bit ARC Processor | Yes |
Processor ROM (Bytes) | 136K |
Processor OTP (Bytes) | 128K |
Processor IRAM/DRAM (Bytes) | 48K/28K |
Security Core | Yes |
Power Management Unit | Yes |
DCDC Step Up/Down Regulator | Yes |
Package Options, Availible User I/O, (and LVDS Pairs):
Package |
Pitch (mm) |
Size (mm) | GW1NRF-LV4B |
QN48 | 0.4 | 6 x 6 | 25(4) |
The GW1NRF Bluetooth FPGA product features FPGA fabric, a power optimized 32-bit microprocessor, a power management unit capable of power as low as 5nA and a Bluetooth 5.0 Low Energy radio. This extends the capabilities of Bluetooth devices by adding the flexible IO and heterogenous computing capabilities of the FPGA.
The GW1NRF BLE Module contains the GW1NRF-4 µSoC FPGA, radio antenna and appropriate passives.
Features
- Integrated Bluetooth 5.0 Low Energy Radio
- 4k LUT FPGA
- 32-bit Power Optimized ARC Processor
- 136kB ROM
- 128kB OTP for power efficiency
- 48kB IRAM and 28kB DRAM
- Power Management Unit
- 5nA Chip Disable1
- < 1uA Sleep and Deep Disable1
- < 5mA Processor + FPGA Active
- Built-in DCDC Step Up/Down Regulator for Battery Operation
- Hardened Security
- TRNG
- AES-128 Encryption Engine
- ECC-P256 Key Generator
- Module - International RF certifications available
Note!
- [1]Does not include any leakage from external regulators when placed in standby
GW1NZ Series Table
Device | GW1NZ-1 | GW1NZ-2 |
LUT4s | 1,152 | 2,304 |
Registers | 864 | 2,016 |
Shadow SRAM (bits) | 4K | 18K |
Block SRAM (bits) | 72K | 72K |
PLLs | 1 | 1 |
User Flash (bits) | 64K | 96K |
Max. GPIOs | 48 | 125 |
Core Voltage Typ. (LV) |
1.2V |
1.2V |
Core Voltage Typ. (ZV) | 0.9V/1.0V | 0.9V/1.0V |
Package Options, Availible User I/O, (and LVDS Pairs):
Package |
Pitch (mm) |
Size (mm) | GW1NZ-1 | GW1NZ-2 | Identifier |
CG25 |
0.35 |
1.8 x 1.8 |
20 |
- |
|
CG56 |
0.35 |
2.4 x 2.9 |
- |
46(14) |
|
CS100H |
0.4 |
4 x 4 |
- |
88(27) |
H |
CS16 |
0.4 |
1.8 x 1.8 |
11 |
- |
|
CS42 |
0.4 |
2.4 x 2.9 |
- |
35(11) |
- |
FN24 |
0.4 |
3 x 3 |
18 |
- |
|
FN32 |
0.4 |
4 x 4 |
25 |
- |
|
FN32F |
0.4 |
4 x 4 |
25 |
- |
F |
QN48 |
0.4 |
6 x 6 |
41 |
41(12) |
|
Package Identifier Definition Table
Feature identifier table denotes additional device capabilities outside of the traditional FPGA options
F | MSPI Programming |
H | 6Gbps MIPI D-PHY Hard Core (1.5Gbps/lane x4 data lanes+ Clock lane) |
User Flash Resources (GW1NZ-2) |
-10,000 write life cycles -More than 10 years of data storage capacity (+85C) -Data bit width: 32 -Storage capacity: 96K bits -Page Erase Capacity: 2,048 bytes -Word write operation time: ≤ 16μs -Page erase time: ≤ 120ms |
Configuring Flash Resources (GW1NZ-2) |
-NOR Flash -10,000 write life cycles -More than 10 years of data storage capacity (+85C) |
MIPI D-PHY RX Hard Core (GW1NZ-2) |
-Support MIPI CSI-2 and DSI, RX device interface -IO Bank6 supports MIPI D-PHY RX -MIPI transmission rate single channel up to 2Gbps -Supports up to four data lanes and one clock lane |
GPIO supports MIPI D-PHY RX/TX in MIPI IO mode (GW1NZ-2) |
-Supports MIPI CSI-2 and DSI, RX, and TX device interfaces -IO Bank0, IO Bank3, IO Bank4, and IO Bank5 support MIPI D-PHY TX, and the transmission rate of a single channel can reach 1.2 Gbps -IO Bank2 supports MIPI D-PHY RX, and the transmission rate can reach 1.2 Gbps in a single channel |
Note!
- In this manual, abbreviations are employed to refer to the package types.
-
JTAGSEL_N and JTAG pins cannot be used as GPIOs simultaneously. However, when mode [2:0] = 001, the JTAGSEL_N pin is always a GPIO, in other words the JTAGSEL_N pin and the four JTAG pins (TCK, TMS, TDI, TDO) can be used as GPIOs simultaneously.
Product Resources
Device | GW1N-2 | GW1N-4 | GW1N-9 |
LUT4 | 2,304 | 4,604 | 8,640 |
Flip-Flop (FF) | 2,304 | 3,456 | 6,480 |
Shadow SRAM Capacity (bits) | 18K | 0 | 16K |
Block SRAM Capacity (bits) | 72K | 180K | 468K |
Number of BSRAM | 4 | 10 | 26 |
User Flash (bits) | 96K | 256K | 608K |
18 x 18 Multiplier | 0 | 16 | 20 |
PLLs | 1 | 2 | 2 |
Total Number of I/O banks | 7 | 4 | 4 |
Max. GPIOs | 126 | 218 | 276 |
Core Voltage Typ. (LV) | 1.2V | 1.2V | 1.2V |
Core Voltage Typ. (UV) | - | - | - |
Core Voltage Typ. (ZV) | - | - | - |
Package Options, Availible User I/O, (and LVDS Pairs):
Package | Pitch(mm) | Size(mm) | GW1N-2 | GW1N-4 | GW1N-9 | Identifier |
QN88 | 0.4 | 10 x 10 | - | 70(11) | - | |
QN88 | 0.4 | 10 x 10 | 58(17) | - | - | H |
QN88F | 0.4 | 10 x 10 | - | - | 70(24) | F |
QN60 | 0.35 | 6 x 6 | - | - | 44(11) | |
QN48 | 0.4 | 6 x 6 | 41(12) | - | - |
Note!
- JTAGSEL_N and JTAG pins cannot be used as I/O simultaneously. The Max. I/O noted in this table is referred to when the four JTAG pins (TCK, TDI, TDO, and TMS) are used as I/O. When mode [2:0] = 001, JTAGSEL_N and the four JTAG pins (TCK, TDI, TDO, and TMS) can be used as GPIO simultaneously, and the Max. user I/O is increased by one. See UG103, GW1N series of FPGA Products Package and Pinout for further
Package Identifier Definition Table
Feature identifier table denotes additional device capabilities outside of the traditional FPGA options
H | 10Gbps MIPI D-PHY Hard Core (2.5Gbps/lane x4 data lanes+ Clock lane) |
GOWIN Semiconductor has been manufacturing automotive grade FPGA since early 2018. Providing fully certified AEC-Q100 Level-2 non-volatile Flash-based and SRAM FPGA devices that support a wide range of interface standards including MIPI-DPHY and LVDS.
GW1NSR Series Table
Parameter | GW1NSR-4 | GW1NSR-4C |
LUT4 | 4,608 | 4,608 |
FF | 3,456 | 3,456 |
B-SRAM bits | 180K | 180K |
B-SRAM quantity | 10 | 10 |
18 x 18 Multiplier | 16 | 16 |
User Flash(bits) | 256K | - |
HyperRAM(bits) | - | 64M |
PSRAM(bits) |
64M | 64M |
NOR FLASH(bits) | - | 32M |
PLLs | 2 | 2 |
OSC | 1,+/- 5% accuracy | 1,+/- 5% accuracy |
Hard Core Processor | - | Cortex-M3 |
I/O Banks | 4 | 4 |
Max. GPIOs | 106 | 106 |
Core Voltage Typ. | 1.2V | 1.2V |
Package Options, Availible User I/O, (and LVDS Pairs):
Package |
Pitch (mm) |
Size (mm) | GW1NSR-4 | GW1NSR-4C | Identifier |
QN48P | 0.4 | 6 x 6 | 39(4) | P | |
QN48G | 0.4 | 6 x 6 | 39(4) | G | |
MG64P | 0.5 | 4.2 x 4.2 | 55(8) | 55(8) | P |
Package Identifier Defination Table
Feature identifier table denotes additional device capabilities outside of the traditional FPGA options
P | PSRAM |
G | Additional Flash |
The GW1NSR series of FPGA products are the first generation products in the LittleBee® family and represent one form of SIP chip.The main difference between the GW1NS series and the GW1NSR series is that the GW1NSR series integrates abundant PSRAM.