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Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

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Arora V series of FPGA Products are the second-generation of Arora family, with abundant internal resources, a new-architecture and high-performance DSP supporting AI operations, high-speed LVDS interfaces, and abundant BSRAM resources. Showcasing advanced 22nm SRAM technology and integrating 270Mbps-12.5Gbps high speed SerDes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps. The first family device, GW5AT-138FC676, features 138K LUT logic resources, 6.4MB block RAM, 1.1MB distributed SRAM, along with advanced DSP blocks, and integrated ADC. Future family devices include 25K (non-Serdes) and 60K LUT devices.

Arora V is supported by GOWIN EDA providing an efficient and easy
to use FPGA hardware development environment support multiple RTL
based programming languages, synthesis, placement & routing, bitstream generation and download, power analysis and in-device logic analyzer.
GOWIN’s LittleBee® family offers flash based non-volatile FPGAs that are low power and offer small packaging footprints (as small as 2.4x2.3mm). As a result, LittleBee FPGAs are leading the industry in I/O intensive source synchronous interfacing and bridging applications such as MIPI CSI-2, MIPI DSI, USB 2.0, Ethernet, HDMI, MIPI I3C and more. They are also an ideal candidate for hardware management applications offering instant-on booting and built-in security functions.

The LittleBee® FPGA family is complimented by multiple innovative product line sub-features such as extended memory, hardened ARM Cortex-M processor cores, security and Bluetooth LE expanding its capabilities and usage compared to traditional FPGA products.
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AI Edge (20201005)
The simulation of human intelligence processes by machines, especially computer systems. Specific applications of AI include expert systems, natural language processing (NLP), speech recognition and machine vision.
Connected to the Future.  From Gbps Ethernet to 5G, GOWIN offers full product portfolio of low power, high-speed interface and small footprint FPGA to meet communication equipment makers’ demand on time-to-market and reduce total...
Smart, Connected and Green! Industry 4.0 requires machines to be intelligent, connected and energy saving.  Our low power, embedded DDR/SDRAM and high performance DSP , GOWIN FPGA enables industrial manufacturers from industrial...
Intelligent, Connected and Safe! Smart and safe driving are today automotive market trends and Advanced Driving Assistance System (ADAS) requires more sensors to be connected in car. GOWIN FPGA provides high IO counts in small form factor...
Accelerate your Innovation.  Product differentiation and time-to-market are the critical success factors in today high competitive consumer marketplace.  GOWIN’s low cost, high performance FPGA with our on-the-shelf IP solutions is the answer...
Visual, Portable and Reliable. The semiconductor contents continue to increase in medical devices and systems as the emerging technology of MEMS and sensor.  Higher resolution of image sensor drives increased resolution, larger size and...
High Performance and Programmability. The emerging cloud computing market drives higher performance and programmability of computing and storage devices in data center everyday. With abundant logic and DSP resources, GOWIN AroraTM ...
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Embedded World Flyer 2023 P3 (2100 × 696 px)
GOWIN Semiconductor to attend Embedded World 2023
  London, UK and Guangzhou, China 7th March 2023 - GOWIN Semiconductor Corporation, the world’s fastest-growing FPGA provider, will attend Embedded World 2023 on 14th-16th of March in Nuremberg, Germany. This will be the third time GOWIN has had its own stand (Hall 3A Stand 340) at Embedded World to showcase and demonstrate our latest FPGA technology to the European market.   Embedded World, held annually in Germany, is Europe’s leading trade show for all embedded solutions and technologies. With over 1000 exhibitors it is one of the world’s largest fairs focussing exclusively on state-of-the-art embedded technologies for IoT and related market spaces.   This year GOWIN will be showcasing and demonstrating, amongst other things, our new Arora-V family of high density, high performance, and low power FPGA. Built on a highly optimized TSMC 22nm process this family will compete fiercely with similar competitive FPGA devices by offering not just the lowest power and prices but also pin-compatible footprint options that will offer customers real alternatives without changing their PCB layout.   Also on the stand will be demonstrations of our latest USB offerings which include for the first time a fully integrated FPGA based solution supporting high resolution UAC (USB Audio Class) 2.0 with integrated soft PHY and controller. Additionally, there will be various demos showcasing display and camera solutions.   Lastly, we are very pleased that, for the first time, the sales and technical team will be joined on our stand, by Jason Zhu, GOWIN CEO, who will be hosting various meetings with invited customers and partners. Let us know if you would like to spend some time with an FPGA industry visionary.   “We are immensely proud to be exhibiting again at Embedded World, and to have Jason joining us.” said Mike Furnival, Vice President of International Sales. “It speaks volumes to the progress that we have made during the past year in terms of differentiated as well as pin-compatible FPGA solutions. Whilst we continue to be the lowest cost provider of low and mid density FPGA devices, we are now in the high-density FPGA world and have emerged as one the most innovative in terms of advanced solutions in the marketplace, adding significant value to our customers and partners.”   GOWIN Semiconductor looks forward to welcoming all interested potential customers and partners to our booth in Hall 3A Stand 340.   About GOWIN Semiconductor Corporation   Founded in 2014, GOWIN Semiconductor Corp. with sales and R&D locations worldwide has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership by using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.    For more information about GOWIN, please visit   Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email   Media Contact: Andrew Dudaronek
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Jason pic HQ
Interface Magazine interview with GOWIN's CEO, Jason Zhu
  SAN JOSE, Calif. and GUANGZHOU, China, January. 12, 2023 GOWIN's CEO Jason Zhu is interviewed by the Interface Editorial Department. Jason goes over GOWIN's recent accomplishments and what is in store for 2023.    What kind of company is GOWIN Semiconductor?   GOWIN was established in 2014 and I believe the company's value lies in its awareness of how to develop products that customers need to go directly into the market.   What kind of products are you developing?   Embedded Flash type small FPGA (LittleBee family) mounted on Tang nano board (Sipeed) and higher-grade basic SRAM type FPGA (Arora family). Each of them has a unique product development that is unique from other companies due to implementing additional memory such as pSRAM and SDRAM. We have also developed a USB soft PHY IP which is not found in other companies. In response to market demands, the LittleBee family provides devices with enhanced security functions and devices equipped with Arm Cortex-M3. We always start with the creation of products with the user in mind and provide various types of support along the road to development.   What is the corporate culture at GOWIN?   When looking at GOWIN from the business and corporate culture aspects, we strive to emphasize creativity.  For example, supporting the Tang Nano on the business side hardly contributes to sales, but we enjoy seeing veteran designers and new hobbyists using the platform to create something new. We would like to expand the base for products like Tang Nano to be used in education and hobby. If a product that is especially easy for young people to use enters the market, GOWIN will eventually be known as a company that supports Tang Nano. I think that supporting creative communities within the space is important for that purpose.   How is business going?   Since its establishment, the total number of shipments has exceeded 50 million. Starting from the Chinese market, sales have increased tenfold in markets other than China (as of 2021). GOWIN's main target market is industry with in-vehicle automotive being second. In-vehicle sales are mainly in China, and we would like to work in Japan in the future. With the spread of EVs, GOWIN has become the No. 1 supplier of FPGAs in China. GOWIN devices are mainly manufactured at TSMC's fab (semiconductor manufacturing facility) in Taiwan. LittleBee and Arora have a process rule of 55nm. The new Arora V we recently announced also uses TSMC's 22nm. We have already acquired AEC-Q100 (in-vehicle standard), but we are planning to acquire functional safety ISO26262 next year.   What is your future road map? We are focusing on future product development in 2023. The ES of the Arora V 60K LUT product will be announced in the 2Q of 2023. In parallel with this, the development of the Arora 7 series is underway. We are also considering cloud and data centers in the market, but our policy is to continue with industry as the focus. Currently, there are more cases where users cannot obtain parts or have difficulty grasping the future roadmap. GOWIN will continue to introduce products to the industrial market to solve such problems.   Could you tell us the position of the Japanese market, or rather, tell us about the top five countries in terms of sales, including China, and give us an approximate ratio?   GOWIN attaches great importance to the Japanese market. We focus on what makes the Japanese market unique and different from other countries. Market sales are divided into four regions. 1st China, 2nd Asia Pacific (including Japan, excluding China), 3rd America (including Canada), 4th EU (including Africa and the Middle East), China 55%, non-China 45%. I mentioned earlier that sales outside of China are growing more than 10 times higher, but domestic sales in China are also growing significantly. Due to supply chain problems and changes in the markets that our competitors were focusing on, we were able to enter markets that we could not previously touch.   Will demand for FPGA package standards such as QFP and BGA take precedence? Please explain how the creators make decisions.   Packages are driven by market needs. For the maker community, I don't like BGA. Debugging is difficult and expensive, and it is difficult for the user to check whether it is properly implemented. However, we supply BGA for users who need space-saving and more I/O. It is easier for GOWIN to distribute QFN and QFP. Even with a single lead frame for a BGA, each PCB in the chip must be custom-made. A general-purpose package can use a general-purpose lead frame. The number of pins is about 88 at maximum for QFN and at least 100 for QFP. Optimization for space issues and I/O count is something we can finally address.  
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MJB V1.2 Pic
GOWIN Semiconductor Corp. Announces New Offerings in MagicJellyBean Educational Program
SAN JOSE, Calif. and GUANGZHOU, China, Dec. 06, 2022 GOWIN Semiconductor Corp. announces new hardware and software offerings in their MagicJellyBean educational program.   GOWIN introduces the MJB™ development board specifically designed for an edge AI learning experience in the education and maker community. This development board enables a seamless connection between programmable logic devices and embedded processors. With both HDMI Rx and Tx interface, users can develop and test their ML models on this board alone. In addition, three accessory boards are offered to help you to deploy various models for different types of data sources: MJB™ camera, MJB™ microphone, and MJB™ accelerometer. All these boards can be purchased at the Amazon GOWIN store near you.   Next, the MJB™ IDE software is an integrated development environment built for MJB machine learning. MJB software integrates with TensorFlow and TensorFlow Lite frameworks to automatically generate AI hardware convolution architectures, MCU C/C++ for driving AI acceleration, and FPGA bitstreams with various sensor inputs. This allows you to deploy machine learning models directly to MJB Board and MJB Mini Board without any FPGA RTL or MCU C/C++ programming. You can download this free software from No License is required.   Lastly, the GOWIN Education version of EDA tools support the FPGA used in MJB™. This allows advanced users to design their MCU+NPU hardware architecture in the FPGA. Significant flexibility is needed in most education programs; GOWIN’s tools allow users to configure the FPGA for their desired application.   “Our focus will be catering to an array of programmers,” said Andrew Dudaronek, Program Director of MagicJellyBean, GOWIN Semiconductor. “Designers will be able to dive into the basics of training a model which will introduce them to TensorFlow. Designers will have an outlet to play with firmware and will have a way to update the C code directly.”   If you are a student diving into FPGAs or a professor looking to start up an FPGA class, MJB™ is a partner and enabler of FPGA educational platforms for universities around the world.   Media contact: is an organization established to enable hobbyists, academic researchers and electronic enthusiasts with FPGA and microcontroller capabilities for embedded edge electronics projects. The intent is to create a community of like-minded individuals who can share ideas, projects and wisdom in the FPGA and microcontroller field through an affordable and easy to use platform.   Visit MagicJellyBean here:
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