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ABOUT US
Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.
PRODUCTS

ARORA V SRAM BASED FPGAS FAMILY
Arora V series of FPGA Products are the second-generation of Arora family, with abundant internal resources, a new-architecture and high-performance DSP supporting AI operations, high-speed LVDS interfaces, and abundant BSRAM resources. Showcasing advanced 22nm SRAM technology and integrating 270Mbps-12.5Gbps high speed SerDes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps. The first family device, GW5AT-138FC676, features 138K LUT logic resources, 6.4MB block RAM, 1.1MB distributed SRAM, along with advanced DSP blocks, and integrated ADC. Future family devices include 25K (non-Serdes) and 60K LUT devices.
Arora V is supported by GOWIN EDA providing an efficient and easy
to use FPGA hardware development environment support multiple RTL
based programming languages, synthesis, placement & routing, bitstream generation and download, power analysis and in-device logic analyzer.
Arora V is supported by GOWIN EDA providing an efficient and easy
to use FPGA hardware development environment support multiple RTL
based programming languages, synthesis, placement & routing, bitstream generation and download, power analysis and in-device logic analyzer.

LITTLEBEE FLASH BASED FPGAS FAMILY
GOWIN’s LittleBee® family offers flash based non-volatile FPGAs that are low power and offer small packaging footprints (as small as 2.4x2.3mm). As a result, LittleBee FPGAs are leading the industry in I/O intensive source synchronous interfacing and bridging applications such as MIPI CSI-2, MIPI DSI, USB 2.0, Ethernet, HDMI, MIPI I3C and more. They are also an ideal candidate for hardware management applications offering instant-on booting and built-in security functions.
The LittleBee® FPGA family is complimented by multiple innovative product line sub-features such as extended memory, hardened ARM Cortex-M processor cores, security and Bluetooth LE expanding its capabilities and usage compared to traditional FPGA products.
The LittleBee® FPGA family is complimented by multiple innovative product line sub-features such as extended memory, hardened ARM Cortex-M processor cores, security and Bluetooth LE expanding its capabilities and usage compared to traditional FPGA products.
MARKET

FEATURED SOLUTION
GOWIN's Multi-Channel Spatial Audio Solution
3D Spatial Audio is a rapidly-emerging consumer electronics segment. GOWIN Semiconductor has developed a different way of creating 3D Spatial Audio. Our solution produces sound waves that users' brains detect at only one ear at a time without a headset, and we use this to produce an immersive home theater surround sound experience from a single loudspeaker array. This greatly simplifies home theater systems, opening an upscale niche into a mass market
Features
Original psychoacoustic technology
Unique sound waves for each ear, spatially encoded
Effective for many listeners in a large area
Wall-to-wall, floor-to-ceiling immersive experience
Produces a multi-channel immersive sound experience from a single smart speaker
MUCH louder than ANY other multi-channel speaker of similar size
Configuration and Scales
Linear arrays
8 or more speakers
1.75" or greater spacing
Array width 14" or greater
3D-Cluster arrays
8 or more speakers
Fits in cylinderic shape
8" diameter and 8" height
More Surround Sound From Less Hardware
Algorithm drives all amplifiers and speakers with all the channels all the time
All hardware is producing EACH channel
Result: +18dB louder sound per channel (1 speaker @ 1 Watt vs. 8 speakers @ 1 Watt each)
Lower cost for greater SPL
Multi-channel soundbars can be more compact
TVs and gaming monitors with embedded micro-speakers can produce impressive surround sound with clearer, more powerful center-channel speech/dialog intelligibility
Total System Architecture
GOWIN's signal processing has been architected for easy implementation into cost-effective consumer products. Its input is compatible with typical "upstream" modules used in many AV receivers and other popular consumer audio products, and its output is compatible with many popular 2-channel and 4-channel Class-D power amplifier ICs. It is capable of being operated as a co-processor that requires no support from other system resources, which further simplifies its implementation
Chip Architecture
It is 100% digital
It operates at a relatively low frequency (24.576MHz clock)
The volume controls, BIQUAD (parametric EQ) filters and matrix filters are programmed via I2C
It requires minimal peripheral circuitry (clock oscillator, power supplies)
It requires very little glue logic and support circuitry
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WHITE PAPERS

PRODUCT LIFE CYCLE MANAGEMENT
A product lifecycle is typically defined by four main phases: introduction, growth, maturity, and decline.
GOWIN Semiconductor designs products and creates the supporting supply chain with the clear intent to support a minimum 15+ year lifecycle, starting from the first production release. GOWIN Semiconductor parts are used extensively in numerous applications that require a long operational lifetime, and therefore, GOWIN Semiconductor makes a strong commitment to the product life cycle. With this commitment, although the minimum lifecycle is 15 years, customers will see that the majority of families will be supported much longer. The longevity of GOWIN Semiconductor products is comparable or longer to other major FPGA suppliers.
In the case of a last-time buy, GOWIN Semiconductor does follow the JEDEC standard

AI AND EDGE COMPUTING
The simulation of human intelligence processes by machines, especially computer systems. Specific applications of AI include expert systems, natural language processing (NLP), speech recognition and machine vision.

COMMUNICATION
Connected to the Future. From Gbps Ethernet to 5G, GOWIN offers full product portfolio of low power, high-speed interface and small footprint FPGA to meet communication equipment makers’ demand on time-to-market and reduce total...

INDUSTRIAL
Smart, Connected and Green! Industry 4.0 requires machines to be intelligent, connected and energy saving. Our low power, embedded DDR/SDRAM and high performance DSP , GOWIN FPGA enables industrial manufacturers from industrial...

AUTOMOTIVE
Intelligent, Connected and Safe! Smart and safe driving are today automotive market trends and Advanced Driving Assistance System (ADAS) requires more sensors to be connected in car. GOWIN FPGA provides high IO counts in small form factor...

CONSUMER
Accelerate your Innovation. Product differentiation and time-to-market are the critical success factors in today high competitive consumer marketplace. GOWIN’s low cost, high performance FPGA with our on-the-shelf IP solutions is the answer...

MEDICAL
Visual, Portable and Reliable. The semiconductor contents continue to increase in medical devices and systems as the emerging technology of MEMS and sensor. Higher resolution of image sensor drives increased resolution, larger size and...

LED DISPLAY

CLOUD COMPUTING AND DATA CENTERS
High Performance and Programmability. The emerging cloud computing market drives higher performance and programmability of computing and storage devices in data center everyday. With abundant logic and DSP resources, GOWIN AroraTM ...
NEWS

2023-11-01
GOWIN Semiconductor Corporation Expands its Arora V FPGA Family with Advanced Features
San Jose, California and Guangzhou, China, November 1, 2023 - GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA company, is excited to announce an expansion of its Arora V high-performance FPGA family. The latest offering leverages cutting-edge 22nm SRAM technology, 12.5Gbps high-speed SerDes interfaces, PCIe hardcore, MIPI hardcore D-phy and C-phy support, RISC-V microprocessor, and DDR3 interfaces. The extended family now includes 15K, 45K, 60K, and 75K LUT device offerings.
The new Arora V family not only complements the previous Arora family but also offers a significant performance boost with lower power consumption. Specifically, the Arora V devices exhibit 30% higher performance and a remarkable 60% reduction in power consumption compared to the Arora GW2A family. Arora-V programming configuration provides designers with a wide array of options including JTAG, SSPI, MSPI, CPU, and the ability to directly program external SPI Flash in JTAG or SSPI Mode. In addition, it allows for indirect programming of external Flash in other modes using a soft-core IP bridge and supports background upgrades, bitstream file encryption, and security bit settings.
Arora V further distinguishes itself by delivering exceptional Single Event Upset (SEU) resiliency compared to competitors. GOWIN has adopted an innovative approach by designing custom SRAM cells, significantly reducing soft error rate effects. To make the handling of SEU-related matters more accessible, GOWIN provides a "SEU Handler" wrapper IP, which allows users to seamlessly access SEU reports and correction functions, enhancing both reliability and efficiency.
The new Arora V family also incorporates an advanced I/O structure capable of recovering received serial data containing an embedded clock using built-in CDR technology at each differential I/O pair. This feature facilitates easy cascading of multiple GPIOs for achieving high data throughput, all without the need for a SERDES-based solution. Solutions such as Ethernet, Industrial Field Buses, and LVDS Bus Applications to name a few, can easily be implemented using EasyCDR.
“We are excited to be offering our latest 22nm technology products for next-generation applications during our innovation phase of growth,” states Scott Casper, Director of Sales, GOWIN Semiconductor, “The improvement in performance and speed as well as the added feature of EasyCDR will take us into solutions not realized by previous families.”
For more information about GOWIN, please visit www.gowinsemi.com
About GOWIN Semiconductor Corp.
Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.
Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
Media Contact:
Andrew Dudaronek
andrew@gowinsemi.com
Learn More

2023-10-16
GOWIN Semiconductor Expands its GW1NZ Series of Low-Cost, Small-Size, and Low-Power Devices
San Jose, California and Guangzhou, China, October 16, 2023 - GOWIN Semiconductor Corporation, the world’s fastest-growing FPGA company, announces today the expansion of their GW1NZ series of low-cost, small size, and low-power devices. GOWIN is introducing the new GW1NZ-ZV2 product as well as additional package offerings for the GW1NZ-LV/ZV1 products. The aim of this introduction is to cater to the previously underserved market demand for compact amounts of programmable logic in small packages that can be seamlessly integrated into cost-sensitive and low power applications.
In a design space where innovation is limited by cost, size, and power considerations, GOWIN is taking the lead in enabling the utilization of FPGAs. This encompasses domains like high-volume consumer markets and IoT applications, where GOWIN is pioneering the provision of exceptionally affordable and energy-efficient devices. “This new generation of GW1NZ series devices is an important milestone in GOWIN Semiconductor’s development,” said Jason Zhu, CEO, of GOWIN Semiconductor FPGA, “The new GW1NZ series presents a revolutionary cost advantage over competing alternatives, even non-FPGA designs. These devices effectively curtail overall board and system expenditures through unparalleled integration.”
The GW1NZ-ZV2 is a 2K LUT device being offered in CS100 and QFN48 packages with more to come. Additionally, the GW1NZ-ZV2 is enabled to utilize GOWIN’s GoConfig IP, a programming technology enabling not only standard JTAG programming but other protocols including I2C and SPI. This gives embedded designers more protocol options to program the devices. The GW1NZ-ZV/LV1 series is adding 2 new low-cost packages to its existing lineup – BGA25 and QFN24. These are in addition to the small size CSP16 and QFN32 already in production today. And the GW1NZ-LV/ZV1 is upgraded to support GOWIN’s GoConfig multiprotocol programming IP in select packages.
At its core, our innovation focuses on a low-cost, small size, and low-power FPGAs fortified with remarkably versatile configuration interfaces:
The standby power can be minimized to an impressive 28uW
GW1NZ-2 devices include MIPI D-phy and C-phy IP interfaces for camera and display interfacing
A library of reference designs available to jump start design efforts for quicker time to market
“Our endeavors culminate in a cutting-edge FPGA solution that not only meets stringent cost and power efficiency requirements but also champions unparalleled configuration adaptability through a variety of interfaces,” said Mike Furnival, VP of International Sales of GOWIN Semiconductor FPGA, “Embedded design engineers will find our easy to use GW1NZ series of devices great for their IoT, wearable, and consumer products.”
Volume pricing for the GW1NZ devices can be lower than $0.50. Please contact your local salesperson for more information.
For more information about GOWIN, please visit www.gowinsemi.com
About GOWIN Semiconductor Corp.
Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.
Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
Media Contact:
Andrew Dudaronek
Learn More

2023-08-28
GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA
GOWIN Is Offering the Andes A25 RISC-V CPU IP and AE350 Subsystem
As Instantiated Hard Cores in Its GW5AST-138 FPGA
[San Jose, Aug. 29, 2023] - Andes Technology Corporation (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, is thrilled to announce that its AndesCore™ A25 RISC-V CPU IP and AE350 peripheral subsystem is hardened and embedded in the GW5AST-138 FPGA chip from GOWIN Semiconductor, the world’s fastest growing FPGA company. This integration, one of the first complete RISC-V microcontrollers in an FPGA, provides designers the A25 processor power and the peripherals most processors require without consuming any FPGA resources. Thus, the hardware team can populate the FPGA with their value-added design while the software team can concurrently create application code based on the rich RISC-V ecosystem.
“Andes is committed to delivering cutting-edge RISC-V technologies allowing developers to create innovative and efficient solutions. The integration of the A25 RISC-V CPU and AE350 peripheral subsystem as a hard core in GOWIN Semiconductor’s GW5AST-138 FPGA marks a significant milestone in achieving this vision,” said Andes North America VP of Sales, Vivien Lin. “This represents a significant milestone for the RISC-V architecture as it provides our joint customers a versatile hardware development platform to create, debug, and verify their ultimate SoC design before committing their netlist for silicon fabrication. For customers not requiring an SoC, it will enable a complete RISC-V computer ready to drive their end applications.”
"In the Arora V family, we incorporate the peripherals that a RISC-V CPU typically requires in hard instantiations," says GOWIN’s Sr. Director of Solution Development, Jim Gao. “We included a fully controllable high-speed SerDes for communication, video aggregation, and AI computing acceleration applications that demand very high data rates. Other instantiated functions include Block RAM modules supporting ECC error correction, high-performance multiple voltage GPIO, and high accuracy clock architecture. These hard functions save the FPGA programmable fabric of up 138K LUT’s for the designers’ unique logic implementation."
About the RISC-V Based GW5AST-138 FPGA:
The AndesCore™ A25 hard core, running at 400MHz, supports the RISC-V P-extension DSP/SIMD ISA (draft), single- and double-precision floating point and bit-manipulation instructions, and MMU for Linux based applications. The AE350 AXI/AHB-based platform comes with level-one memories, interrupt controller, debug module, AXI and AHB Bus Matrix Controller, AXI-to-AHB Bridge and a collection of fundamental AHB/APB bus IP components pre-integrated together as a system design. DDR3 controller and SPI-Flash controller in the FPGA fabric back up the A25's 32KByte I-Cache and D-Cache after cache misses. Off chip DDR3 provides data memory, SPI-Flash contains the A25's instruction memory (codes copied from SPI-Flash into DDR3 and Cache upon boot-up). Besides hard instantiated functions, the GOWIN GW5AST-138 FPGA fabric affords 138K LUTs for custom design implementation. GOWIN EDA provides an easy-to-use FPGA hardware development environment for the Arora V. The environment supports multiple RTL-based programming languages, synthesis, placement and routing, bitstream generation and download, power analysis and in-device logic analyzer.
Price & Availability
The GW5AST-138 FPGA with SDK with GOWIN_V1.9.9 Beta-3 will be available August 18 through distribution.
About GOWIN Semiconductor Corp.
Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.
For more information about GOWIN, please visit www.gowinsemi.com
About Andes Technology
Eighteen years in business and a Founding Premier member of RISC-V International, Andes is a publicly listed company (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), a leading supplier of high-performance/ low-power 32/64-bit embedded processor IP solutions, and the driving force in taking RISC-V mainstream. Its V5 RISC-V CPU families range from tiny 32-bit cores to advanced 64-bit Out-of-Order processors with DSP, FPU, Vector, Linux, superscalar, and/or multi/many-core capabilities. By the end of 2022, the cumulative volume of Andes-Embedded™ SoCs has surpassed 12 billion.
For more information, please visit https://www.andestech.com.
Follow Andes on LinkedIn, Twitter, Bilibili and YouTube!
Media Contact: Andrew Dudaronek
andrew@gowinsemi.com
Learn More