London, UK and Guangzhou, China 13th March 2024 - GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA provider, is set to participate in Embedded World 2024 from April 9th to 11th in Nuremberg, Germany. This will be our fourth consecutive appearance at the EW exhibition and coincides with GOWIN’s tenth anniversary year. Our home for this year’s event will be Hall 3A Stand 340 where we will be showcasing and demonstrating our latest FPGA technology.   Embedded World, hosted annually in Germany, stands as Europe's premier trade show for embedded solutions and technologies. Boasting over 1000 exhibitors, it ranks among the world's largest fairs dedicated to cutting-edge embedded technologies for IoT and related market segments.   Following significant automotive success in Asia, GOWIN will continue focusing on the European automotive market this year. We will showcase our latest FPGA offerings, including our new Arora V series devices, celebrated for their exceptional SerDes performance, and energy efficiency. Utilizing TSMC’s 22nm  LP process with proven automotive grade-1 capability, this new lineup is primed to make a significant impression on the mid density FPGA market. In addition to featuring industry-leading power efficiency with very competitive pricing,  this new device family is also available in a range of competitor pin-compatible package options, enabling customers to explore replacement options without redesigning their PCB hardware.   Stand demos this year will include MIPI CSI camera to HDMI display bridging using our new Arora-V GW5A-25 family, Universal Audio Class (UAC2) USB2.0 2x2 audio interface using our low-cost LittleBee Flash-based GW1N-9 family, a AE350 hardcore RISC-V demo using our latest Arora-V GW5AST-138 µSoC FPGA and Field Oriented Motor Control (FOC) using our mid-range Arora-2 family devices.   Finally, we are delighted to announce our field sales team will be accompanied by Jason Zhu, CEO of GOWIN, who will be conducting meetings with invited customers and partners. Please contact us if you are interested in scheduling time with a FPGA industry visionary.   “We are extremely excited to be once again participating at Embedded World in Nuremberg, Germany, showcasing our growing portfolio of products, IP, and innovative solutions.” said Mike Furnival, Vice President of International Sales. “Additionally, to have our CEO, Jason Zhu, joining us clearly illustrates the importance of our global sales efforts and resultant customer relationships. We believe that participation at this show will further cement our position as the true leader in the much changed low and mid density FPGA marketplace”.   GOWIN Semiconductor looks forward to welcoming all interested potential customers and partners to our booth in Hall 3A Stand 340.   Supporting Resources:   To schedule a meeting with GOWIN Semiconductor at Embedded World 2024, please fill out this Google Form here: https://docs.google.com/forms/d/e/1FAIpQLSfsROeh2n92rf3VWtl6-BBWNPMaem2aDyPBfHJSrHRnQ9FhDQ/viewform For more information about GOWIN Semiconductor, please visit: https://www.gowinsemi.com/en/ For more information about and to register for the conference, visit https://www.embedded-world.de/en About GOWIN Semiconductor Corporation Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2024 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com

  San Jose, California and Guangzhou, China, November 1, 2023 - GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA company, is excited to announce an expansion of its Arora V high-performance FPGA family. The latest offering leverages cutting-edge 22nm SRAM technology, 12.5Gbps high-speed SerDes interfaces, PCIe hardcore, MIPI hardcore D-phy and C-phy support, RISC-V microprocessor, and DDR3 interfaces. The extended family now includes 15K, 45K, 60K, and 75K LUT device offerings.   The new Arora V family not only complements the previous Arora family but also offers a significant performance boost with lower power consumption. Specifically, the Arora V devices exhibit 30% higher performance and a remarkable 60% reduction in power consumption compared to the Arora GW2A family. Arora-V programming configuration provides designers with a wide array of options including JTAG, SSPI, MSPI, CPU, and the ability to directly program external SPI Flash in JTAG or SSPI Mode. In addition, it allows for indirect programming of external Flash in other modes using a soft-core IP bridge and supports background upgrades, bitstream file encryption, and security bit settings.   Arora V further distinguishes itself by delivering exceptional Single Event Upset (SEU) resiliency compared to competitors. GOWIN has adopted an innovative approach by designing custom SRAM cells, significantly reducing soft error rate effects. To make the handling of SEU-related matters more accessible, GOWIN provides a "SEU Handler" wrapper IP, which allows users to seamlessly access SEU reports and correction functions, enhancing both reliability and efficiency.   The new Arora V family also incorporates an advanced I/O structure capable of recovering received serial data containing an embedded clock using built-in CDR technology at each differential I/O pair. This feature facilitates easy cascading of multiple GPIOs for achieving high data throughput, all without the need for a SERDES-based solution.   Solutions such as Ethernet, Industrial Field Buses, and LVDS Bus Applications to name a few, can easily be implemented using EasyCDR.   “We are excited to be offering our latest 22nm technology products for next-generation applications during our innovation phase of growth,” states Scott Casper, Director of Sales, GOWIN Semiconductor, “The improvement in performance and speed as well as the added feature of EasyCDR will take us into solutions not realized by previous families.”    For more information about GOWIN, please visit www.gowinsemi.com   About GOWIN Semiconductor Corp.   Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek andrew@gowinsemi.com

San Jose, California and Guangzhou, China, October 16, 2023 - GOWIN Semiconductor Corporation, the world’s fastest-growing FPGA company, announces today the expansion of their GW1NZ series of low-cost, small size, and low-power devices. GOWIN is introducing the new GW1NZ-ZV2 product as well as additional package offerings for the GW1NZ-LV/ZV1 products.  The aim of this introduction is to cater to the previously underserved market demand for compact amounts of programmable logic in small packages that can be seamlessly integrated into cost-sensitive and low power applications. In a design space where innovation is limited by cost, size, and power considerations, GOWIN is taking the lead in enabling the utilization of FPGAs. This encompasses domains like high-volume consumer markets and IoT applications, where GOWIN is pioneering the provision of exceptionally affordable and energy-efficient devices. “This new generation of GW1NZ series devices is an important milestone in GOWIN Semiconductor’s development,” said Jason Zhu, CEO, of GOWIN Semiconductor FPGA, “The new GW1NZ series presents a revolutionary cost advantage over competing alternatives, even non-FPGA designs. These devices effectively curtail overall board and system expenditures through unparalleled integration.”   The GW1NZ-ZV2 is a 2K LUT device being offered in CS100 and QFN48 packages with more to come.  Additionally, the GW1NZ-ZV2 is enabled to utilize GOWIN’s GoConfig IP, a programming technology enabling not only standard JTAG programming but other protocols including I2C and SPI. This gives embedded designers more protocol options to program the devices.   The GW1NZ-ZV/LV1 series is adding 2 new low-cost packages to its existing lineup – BGA25 and QFN24.  These are in addition to the small size CSP16 and QFN32 already in production today.  And the GW1NZ-LV/ZV1 is upgraded to support GOWIN’s GoConfig multiprotocol programming IP in select packages.   At its core, our innovation focuses on a low-cost, small size, and low-power FPGAs fortified with remarkably versatile configuration interfaces:   The standby power can be minimized to an impressive 28uW GW1NZ-2 devices include MIPI D-phy and C-phy IP interfaces for camera and display interfacing A library of reference designs available to jump start design efforts for quicker time to market “Our endeavors culminate in a cutting-edge FPGA solution that not only meets stringent cost and power efficiency requirements but also champions unparalleled configuration adaptability through a variety of interfaces,” said Mike Furnival, VP of International Sales of GOWIN Semiconductor FPGA, “Embedded design engineers will find our easy to use GW1NZ series of devices great for their IoT, wearable, and consumer products.”   Volume pricing for the GW1NZ devices can be lower than $0.50.  Please contact your local salesperson for more information. For more information about GOWIN, please visit www.gowinsemi.com   About GOWIN Semiconductor Corp.   Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2023 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Andrew Dudaronek