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MIPI DevCon 2018
2018-10-21
Gowin Semiconductor Corp. Attends MIP DEVCON, SEOUL 2018 Guangzhou, China, October 21, 2018 – Gowin Semiconductor Corp., the leading programmable logic devices provider in China, attended MIPI DevCon Seoul 2018 on 19 October 2018 at Millennium Seoul Hilton and demonstrated Gowin industry leading I3C solution based on Gowin LittleBee® family GW1N9 devices.   MIPI DevCon is the annual conference organized by MIPI Alliance and tailored to developers who are interfacing sensors in mobile, IoT or automotive designs, or integrating and testing imaging, displays and touch components in connected cameras, tablets, laptops and other devices. MIPI DevCon Seoul brings the latest information on MIPI specifications to developers in the region.   As member of MIPI Alliance, Gowin Semiconductor is invited to demonstrate her industry leading I3C solution in the event. The I3C demo is based on Gowin low power, non-volatile LittleBee™ family GW1N-9 device and GOWIN I3C-ECO-IP package to provide I3C Master and I3C Slave solution. GIWN-9 is the first product in the FPGA industry supported MIPI I3C and MIPI D-PHY GPIO standard; and GOWIN I3C-ECO-IP package is fully compliant with MIPI Alliance’s I3C standard. The current version of GOWIN I3C-ECO-IP package supports SDR-Mode (Single-Data-Rate) and will support DDR-Mode (Double-Data-Rate) with full features set including I3C-Master-Salve-Combined, I2C-Master-Salve-Combined, I3C2SPI-bridge, I3C2UART-bridge, SPI-Master-Salve-Combined, and UART-Host-Device-Combined in its upcoming versions.     “We are excited to be invited to demonstrate our industry leading I3C solution in the MIPI DevCon Seoul,” said by Stanley Tse, Regional Sales Director of Gowin Semiconductor Corp., “Gowin Semiconductor is the first FPGA supplier in the industr to provide MIPI leading I3C solution to market and we have tremendous success since we launched our solution this January. We provide the most cost effective, low power, programmable and easy to use I3C solution in silicon to enable customers to validate their I3C slave chipsets with Gowin  GW1N-9 devices and GOWIN I3C-ECO-IP package . Customers around the world including United States, China, Europe, Korea, Taiwan, South East Asia are using Gowin I3C solution to accelerate their products launched to market. In this MIPI DevCon, we are excited to see that I3C is being the emerging standard in mobile, wearable and iOT application and extending to automotive and other market segment driven by MIPI Alliance; and we, Gowin Semiconductor, is honor to accelerate the market adoption of I3C with our leading FPGA products and solution.”   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about Gowin, please visit www.gowinsemi.com       @Copyright 2018 GOWIN Semiconductor Corp. Gowin, LittleBee®, GW1N/NR®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of Gowin Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com
Arm_TechCon_2018_Design_Innovation_of_the_Year_Finalist_1600x900
2018-10-10
GOWIN Semiconductor’s GW1NS Family of Products Named Arm TechCon 2018 Innovation Award Finalist for Design Innovation of the Year GUANGZHOU, China and SAN JOSE, Calif., Oct. 10, 2018 – GOWIN Semiconductor today announced that its GW1NS product family was named a 2018 Arm TechCon Innovation Award finalist for design innovation of the year.   GOWIN's GW1NS-2C is the first of its microprocessor-based SoC family. The architecture of the product is unique in that it uses a shared resource technology. Typically, a microprocessor is designed with the core of the processor connected to peripherals via a bus architecture. The peripherals could include JTAG, SRAM memory, I/O interfaces, PLL's, oscillators, etc The GW1NS-2C shares its peripheral resources with a barebone Arm Cortex M3 to leverage the complete system for size and power. In addition, because the peripheral functionality is located inside the FPGA portion of the SoC, it is possible to change the peripheral functionality by reprogramming the FPGA fabric. This allows for complete flexibility in a SoC environment that no other microprocessor product can offer today.   The Arm TechCon Innovation Awards program celebrates leading-edge Arm-based technologies that have spawned new applications and sparked innovation in systems design. Arm TechCon, the world's leading conference and exhibition showcasing Arm-based technologies, will be held Oct. 16-18 at the San Jose Convention Center.   A tour of finalists' booths and their technologies will be conducted at Arm TechCon Wednesday Oct. 17 at 3:30 p.m. Winners will then be announced at 5 p.m. in the expo theater. For more information and to register for the event, please visit armtechcon.com.   "We are honored to receive this recognition from Arm. As a partner, they have been very supportive of our approach to innovation,” said Scott Casper, Director of Sales, GOWIN Semiconductor. “The GW1NS family demonstrates incredible functionality and flexibility needed for the success of today’s system designs. We are happy to be accelerating growth in this field.”   About GOWIN Semiconductor Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   About Arm Arm technology is at the heart of a computing and connectivity revolution that is transforming the way people live and businesses operate. Our advanced, energy-efficient processor designs have enabled the intelligent computing in more than 125 billion chips. This technology combined with our IoT software and device management platform enable customers to derive real business value from their connected devices.   @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email scott@gowinsemi.com
Generic_Social-Media-Graphic-600x600
2018-10-01
GOWIN SEMICONDUCTOR TO SHOWCASE NEW EMBEDDED ARM CORE FPGA PRODUCTS AT ARM TECHCON 2018 Guangzhou, China and San Jose, CA, September 2018 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, will be exhibiting its new family of embedded Arm core FPGAs at Arm TechCon 2018 in San Jose, California.   GOWIN staff will be available to meet during the conference in booth #1226 to discuss the new products. In addition, demonstrations will be ongoing to show the feature set of the new product family suitable for various applications.   "These new products address the needs required in distributed computing, especially at the edge, where resources are limited. Power and size are a concern for edge implementations. GOWIN’s innovative approach addresses these concerns with optimized solutions,” said Scott Casper, Director of Sales, Americas, for GOWIN Semiconductor. “We are excited to participate in Arm TechCon 2018 to showcase our new embedded Arm core FPGA solutions. These solutions will allow designers to face the challenges with edge applications.”   GOWIN’s new embedded Arm core FPGA products include an Arm Cortex-M3 with an FPGA fabric, Flash NVM, SRAM, ADC, USB, and MIPI PHY. In addition, this device comes with an optional 32Mb of embedded memory, allowing for a true SoC solution. GOWIN will be exhibiting at ArmTechCon 2018 in booth #1226 from October 16-18. To request a meeting, please call (408) 646-2118 or send a request to scott@gowinsemi.com.
Low power
2018-09-11
GOWIN Semiconductor Unveils the Latest Embedded Memory Products for Their Families of Programmable Logic Devices Guangzhou, China, September 17, 2018 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, announces 2 new additions to the current families of embedded memory FPGA devices, the GW1NR-LV4MG81 and GW1NSR-LX2CQN48.  As computing functions are being distributed to edge locations, the need for silicon to adapt to these new uses is becoming prevalent.  The 2 new embedded FPGA devices were designed with low power, small package size, and low cost in mind.    Adopting an edge to cloud infrastructure is challenging.  Each portion of the chain has its own unique characteristics in design.  For the edge, size of sensor or data gatherer affects product real estate; power consumption affects the power source, especially battery life.  The new embedded memory FPGA devices solve these issues by enhancing the integration of multiple devices into a nice, single package device.   “GOWIN’s vision has always been one of developing new products for customer’s needs,” said Jason Zhu, CEO of GOWIN Semiconductor.  “We saw a lack of product integration at the edge and aimed to fix this with easy to use solutions at cost-effective price points.”   The GW1NR-LV4MG81 is a 4K LUT FPGA fabric with 64Mb internal high-speed memory.  The package size is ultra-small, 4.5mm x 4.5 mm PBGA and .83mm thick.  A great logic device for applications where the thickness is an issue.   Power consumption has been optimized to the lowest possible using TSMC’s 55nm LP process.  And up to 69 user IO’s are available supporting GOWIN’s flexible IO structures.   In a 5mm x 5mm QFN package, the GW1NSR-LX2CQN48 is GOWIN’s first device that combines a 2K LUT FPGA fabric with 32Mb internal high-speed memory and an Arm Cortex M3 microprocessor.  With additional user programmable flash, internal SRAM, ADC, and both USB2.0 and MIPI D-PHY interfaces, this makes the GW1NSR-LX2CQN48 a true SoC to solve low power requirements at the edge and elsewhere.    GOWIN offers a complete all-in-one toolchain for both FPGA fabric programming and Cortex M3 programming.  In addition, a complete library of IP cores and reference designs are available to assist in developing platform solutions.  All of these resources are available for download on GOWIN’s website, www.gowinsemi.com.   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com     @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email scott@gowinsemi.com  
US edge
2018-08-27
GOWIN Semiconductor Corp. Announces RISC-V Microprocessor Implementation for GOWIN FPGA Solutions and Expands Sales Channels in the Americas Region GuangZhou, China, Aug. 27, 2018 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, announces their development of RISC-V Microprocessor IP implemented in their current ARORAÒ Family GW-2A FPGA products.  In addition, GOWIN launches an Industry Early Adopter Program to kickstart engineering design activity.  The Industry EAP includes: an FPGA programming bit-file reference design with RISC-V Microprocessor core, AHB & APB Bus, Memory Control & Peripherals, as well as the GW-2A development board for a complete, ready to use solution.   RISC-V is a free and open ISA enabling a new era of processor innovation through open standard collaboration. The RISC-V ISA has been designed with small, fast, and low-power real-world implementations in mind without over-architecting for a particular microarchitecture style. The instruction set also has a substantial body of supporting software for a comprehensive design ecosystem.   “GOWIN’s FPGA solutions showcase the growing adoption of RISC-V around the world. It’s exciting to see how the RISC-V ecosystem is maturing as more companies design innovative implementations based on the free and open ISA,” said Rick O’Connor, executive director of the non-profit RISC-V Foundation.   The GOWIN Arora® Family GW-2A FPGAs offer best-in-class performance at an effective cost. With abundant logic, high performance DSP resources, and high speed I/O, the family is optimized for co-processing of computation tasks while hosting the RISC-V Microprocessor soft core. The Arora® family is also the first FPGA with embedded DRAM in the industry, allowing customers to design without using up I/O for external memory.   GOWIN also announces today the appointment of Edge Electronics as their US National Distributor and EBBM, Inc as their East Coast Manufacturers Representative.  “Demand is high for our innovative FPGA products serving the low to mid density logic element markets,” said Scott Casper, Director of Sales for GOWIN’s Americas Region, “The need for the right channel partners is necessary for our growth.  We are excited to be working with Edge and EBBM as we continue our Americas expansion plan.”       “GOWIN Semiconductor is a natural fit alongside our semiconductor and LCD solutions product offerings, both of which are geared toward serving North American industrial, medical and automotive OEM markets among others,” says Michael Pollina, Edge Electronics’ VP Operations & Procurement. “GOWIN’s collection of development tools in tandem with Edge’s engineering team will make it simple for customers to transition existing designs or start new projects with low power, space-efficient and cost-effective FPGA solutions.”   "We are thrilled to be working with GOWIN, one of the Silicon60 Most Remarkable Global Technology Startups," said Chief Executive Officer of EBBM, Inc., Alex Angelou. "EBBM, Inc has been helping custom logic architects quickly articulate their design and beat their competition to market for 14 years. GOWIN’s One-Stop Complete Solution, including DVK, EDA, IP, is a perfect match to bring the competitive advantage to more companies," said EBBM, Inc. Chief Strategy Officer Ken Cheo.   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   About Edge Electronics: Edge Electronics, Inc., based in Bohemia, N.Y., is a leading authorized distributor of electronic components (semiconductors, passives, and interconnect), display solutions (LCDs and related products), embedded computing and storage products. With strategically located sales offices throughout the U.S., Edge focuses on providing industrial, medical, military and commercial OEMs and contract manufacturers with the most personalized customer service in the industry, easy access to the latest technologies, and fully customizable solutions that are the perfect fit for each customer's specific application and business model. Founded in 1990, Edge Electronics is a certified Women's Business Enterprise (WBE) that is both established and flexible, making it an invaluable supply-chain partner for any organization. For additional information about Edge Electronics, Inc., please visit www.edgeelectronics.com. About EBBM Inc. EBBM, Inc. was established in 2004 as a Field Application Engineering and Sales firm for Disruptive CPLD, FPGA, ASIC, and SoC custom logic manufacturers. Products include all logic densities from small to very high . For more information about EBBM, Inc., please visit www.ebbmsemi.com.     @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email scott@gowinsemi.com  
Gowin_Alcom
2018-08-20
Gowin announces RISC-V implementation of Arora® FPGA and an Alcom Electronics distribution tie-up in Europe Guangzhou, China, August 20, 2018 – Gowin Semiconductor Corp., the leading programmable logic devices provider in China, today announces Industry Earlier Adopter Program of RISC-V microprocessor implementation of Gowin ARORA® Family, including FPGA programming bit-file of a system level reference design with RISC-V MCU core, AHB & APB Bus, Memory Control & Peripherals, as well as GW-2A development board as total solution.               RISC-V is an open specification of an Instruction Set Architecture (ISA). The RISC-V ISA has been designed with small, fast, and low-power real-world implementations in mind, but without over-architecting for a particular microarchitecture style. Gowin Arora® Family GW-2A FPGA are designed to offer the best-in-class performance cost ratio FPGA. With abundant logic, high performance DSP resources, and high speed I/O, the family is optimized for co-processing to offload the application processor on intensive computation tasks, as well as neatly optimized as the direct host of embedded microprocessor, like RISC-V ISA MCU soft core. The Arora® family is also the first FPGA with embedded SRAM in the industry, which gives customers more useable I/O. Gowin Industry Earlier Adopter Program of RISC-V Microprocessor offers a total solution including, GW-2A FPGA Device Chip GW-2A FPGA Development Board Hardware, with Micro-USB Download/Debug Cable GW-2A FPGA programming bit-file of a system level reference design with RISC-V MCU core, AHB & APB Bus, Memory Control & Peripherals Gowin FPGA Design EDA Software Suite, including Gowin IP-Core-Generator, supplying a rich set of Verilog Design IPs of Memory Controller, Datapath, DSP, etc., for building customized peripherals and/or interfacing module to the RISC-V MCU System Software Tool Chain (C-Code Compiler, Linker, Debugger) as well as RSIC-V MCU peripheral Software drivers, and built-in libraries for customized C-Code development   At the same time, Gowin also announces appointing Alcom Electronics as distributor in Benelux covering Europe. The appointment represents that Gowin further strengthens her distribution network and support to customers in Europe.   “We are excited to appoint Alcom Electronics as our distributor in Benelux covering Europe markets. With more than 50 expertise focusing on providing customers one-stop service from design concept to reliable logistics, Gowin will further strengthen our high quality support to customers in Europe,” said by Stanley Tse, Regional Sales Director of Gowin Semiconductor Corp. “In less than one year, Gowin has completed our distribution and support network over the world and we are the only China based FPGA company can offer our products internationally. This is a significant recognition on our products innovation and quality of services from the industry. With our first FPGA SoC GW1NS-2 launches and Gowin Industry EAP of RISC-V to the market, Gowin expands our severable markets from programmable logics to the huge microprocessor market, the partnership with Alcom is important to our serve our customers in Europe as Alcom has good customer coverage and strong technical team on embedded system.”   “Alcom electronics has a proven track record as a Specialist Distributor in bringing new innovations and technologies to the Electronic components and Module markets.  Programmable Logic Solutions have always been a key corner stone in Alcom’s business historical success”, said by Luc Spiessens, Managing Director of Alcom Electronics for Belgium/Luxembourg, “Therefore, we are proud to sign up with Gowin as a new challenger providing innovative programmable solutions with the aim to win market share from well-known competitors.  A strong price/performance ratio and integration level in combination to the lowest power consumption are some of the key differentiators in the offering.  As a strong team, Alcom and Gowin will jointly work together to support customers starting at the design phase.  Alcom invested into training programs for its Sales & Application resulting into the appointment of Gowin Certified FAE’s allowing the fastest time-to-market.  The team can be contacted at Alcom via www.alcom.be for Belgium and Luxembourg and www.alcom.nl for the Netherlands.” About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about Gowin, please visit www.gowinsemi.com   About Alcom Electronics Alcom electronics is the leading “technical distributor/stocking rep and manufacturers’ representative” for Electronic Components, Wireless Modules, Embedded Computing & Communications Technology, Optoelectronics and Power Solutions in the Benelux. Since its inception in 1980 we sell high quality system components and integrated solutions with all round services. Alcom has been the trend-setter providing complex and/ or customer specific solutions to approximately 1500 customers by Specialism, Knowledge and Expertise starting at the design concept. We bring leading edge innovations with a competent and dedicated team of 50 people to the market servicing a wide variety of customers either OEM, big, small or start-ups active in diverse vertical market segments and applications securing our growth For more information about Alcom, please visit www.alcom.be for Belgium and Luxembourg and www.alcom.nl for the Netherlands.   About RISC-V Foundation RISC-V (pronounced “risk-five”) is a new instruction set architecture (ISA) that was originally designed to support computer architecture research and education and is now set to become a standard open architecture for industry implementations under the governance of the RISC-V Foundation. The RISC-V ISA was originally developed in the Computer Science Division of the EECS Department at the University of California, Berkeley. The RISC-V Foundation, a non-profit corporation controlled by its members, directs the future development and drives the adoption of the RISC-V ISA. Members of the RISC-V Foundation have access to and participate in the development of the RISC-V ISA specifications and related HW / SW ecosystem. For more information about RISC-V Foundation, please visit https://riscv.org     @Copyright 2018 GOWIN Semiconductor Corp. Gowin, LittleBee®, GW1N/NR®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of Gowin Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com
GW1NS-small
2018-07-24
GOWIN Semiconductor Corp. Announces LittleBee™ Family GW1NS Series GW1NS-2K FPGA SoC Device Engineering Samples and Development Board Available Guangzhou, CHINA, July 23rd 2018 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces Gowin first FPGA SoC devices LittleBee™ family GW1NS series, GW1NS-2, engineering samples and development board available now. The availability of GW1NS is the prologue of Gowin strategy on artificial intelligence (AI) and the emerging edge computing market.     GW1NS-2 FPGA SoC device inherits the innovation of LittleBee™ family with embedded ARM Cortex-M3 hardcore processor and integrated USB2.0 PHY, user flash, SRAM read/write controller and ADC convertor, providing customers all-in-one embedded solution with programable logic features in one chip. With Gowin integrated development environment, engineers can develop their hardware and software in a single platform, which is another innovation of FPGA design platform and reduces engineering design cycle.   As the first Gowin FPGA SoC device, GW1NS-2 adopts ARM Cortex-M3 as embedded hardcore processor to utilize system control function with minimum internal memory. The integrated flexible and high performance FPGA logic elements provide high computational power for engineers to implement various efficiency control peripherals and exceptional system interrupts. As a member of LittleBee™ family, GW1NS-2 provides customers all leading features of the family like high performance logic, low power consumption, high IO to logic ratio, instant-on, non-volatile, high security, abundant package option, high design flexibility and low cost features.   GW1NS-2 FPGA SoC devices offer seamless connection between programmable logic devices and embedded processor, compatible with wide range of peripheral devices standard and reduce system cost significantly. GW1NS-2 is designed for various applications of industrial control, communication infrastructure, Internet-of-things, servo control, smart home, security encryption and consumer electronics.   As shown in Figure1, the application development of GW1NS-2 FPGA SoC integrates hardware and software design flow, i.e., FPGA hardware logic design flow and embedded processor software design flow. The primary objective of FPGA SoC design is to configure the FPGA logic elements to be various physical peripherals of the embedded processor (CPU). After completing the architecture and hardware design with the FPGA logic, engineers can do embedded processor software programming to configure these peripherals. Gowin provides GW1NS-2 FPGA SoC devices and driver library, combining the software design tools (Compiler, Linker, Debugger) in an integrated development environment to support GW1N2-S FPGA SoC embedded processing programming; and also support ARM-MDK and GNU software design tools.         Gowin Semiconductor provides customers the new generation FPGA development environment supporting GW1NS series FPGA SoC device, which addressed the market needs and fully proprietary by Gowin Semiconductor Corp. The new development environment can perform FPGA synthesis, place and route, bitstream file generation and download in an one-stop integrated environment.               “GW1NS is a true miniaturized FPGA-SoC system in one chip,” said by Mr. Jim Gao, Senior Manager of IP core R&D department, Gowin Semiconductor Corp, “GW1NS leverages the advantages of FPGA programmable features to enable customers to design the interfaces and peripherals they needs in different applications scenarios with the integrated 1.7K LUTs low power FPGA logics, and configure these peripherals with the embedded CPU. The device directly integrates the data processing function of CPU with low density FPGA into one FPGA SoC system; such integration opens a new frontier of FPGA applications and systemization.               “GW1NS-2 is the first devices in the FPGA industry to integrate Cortex-M3 MCU and 1.7K LUTs logic in a single FPGA SoC”, said by Mr. TP Wang, Vice President of Engineering, Gowin Semiconductor Corp, “Gowin Semiconductor innovatively introduces low-density, non-volatile, embedded flash memory FPGA devices into wide range of market such as consumer, industrial control, IoT, security and get tremendous success in the market. GW1NS-2 FPGA SoC device fully utilizes the complementary features of MCU and FPGA, together with flexible peripherals of USB PHY and ADC, which widely extends the FPGA markets and applications. The availability of GW1NS-2 is also the prologue of Gowin strategy on AI and the emerging edge computing market. GW1NS series is the ideal embedded processor solution with programmability to address the applications like pattern and voice recognition in AI and edge computing end points”   Gowin Semiconductor always focus on product advantages accumulation, innovation and differentiation”, said by Stanley Tse, Reginal Sales Director of Gowin Semiconductor Corp, “The official launches of GW1NS-2 is our first trial on SoC market with our proven success LittleBee™ FPGA family + ARM hardware architecture. With this based architecture, we integrate high speed MIPI DPHY, ADC and other applications modules; together with our advantages on small package and low cost. We are very confident on market acceptance of GW1NS-2 and create another tremendous success of LittleBee™ family in broad range of applications, e.g., video interface, smart connected devices, portable consumer and ioT, AI and edge computing end points.     About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., with headquarter and major R&D in China, our vision is to accelerate worldwide customers innovation by our programmable solution. We focus on optimizing our products and removing barriers for customers to use programmable logics devices. Our commitment to technology and quality enables customers to reduce total cost of ownership by using FPGA on their production boards. Our offering includes board portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs and development kits.  And we serves customers in consumer, industrial, communication, medical and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   @Copyright 2017 GOWIN Semiconductor Corp. GOWIN, LittleBee™, GW1N/NR, Arora™, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com  
NewTech1
2018-05-31
GOWIN Semiconductor Corp. Attends New-Tech 2018 in Tel Aviv, Israel Tel Aviv, Israel, May, 29, 2018 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, attends New-Tech Exhibition 2018 in Tel Aviv, Israel, with his distribution partner, Eldis Technology, to demonstrate Gowin latest FPGA technology. In the event, Gowin Semiconductor officially launches our leading FPGA products to Israel and Europe market with Eldis Technology. The New-Tech 2018 Exhibition is the largest and major exhibition of the hi-tech and electronics in Israel and attracts more than 25,000 professionals from Israel and Europe. As the first and sole China based FPGA company in the New-Tech 2018, Gowin demonstrates our leading MIPI I3C master and slave solution based on Gowin LittleBee® GW1N-9 device. The professionals attended to the show are impressed by Gowin leading technology and they are highly positive to experience a China based FPGA new comer. They are expecting Gowin and Eldis Technology can offer Israel and Europe market a new FPGA option with innovative technology and cost effective solution.
Gowin_FMA
2018-05-21
GOWIN Semiconductor Accelerates Growth with Opening of New North America Sales Office in Silicon Valley     The new office location enables GOWIN Semiconductor to accelerate marketing and sales growth in the Americas Region   SAN JOSE, CA  May 17, 2018 – GOWIN Semiconductor Corp., a leading provider of low power, small package, and performance driven Field Programmable Gate Arrays (FPGA), recently opened a sales office in Silicon Valley to accommodate the rapid growth of programmable logic devices used in consumer, communications, industrial, automotive, and medical marketplaces throughout the Americas Region.       In addition to the new office in Silicon Valley, GOWIN Semiconductor has signed on Fahrner-Miller Associates, an electronics manufacturers representative, to market and sell the complete line of FPGA products in Northern California and Northern Nevada.  This assignment helps to fast-track GOWIN’s presence and penetration into one of the worlds leading technical regions for development.   “The decision to expand our presence into North America has been on our roadmap for a long time as part of our business growth strategy, to complement our business success in Europe and Asia,” said Jason Zhu, CEO of GOWIN Semiconductor Corp.  “The Silicon Valley area is rich with opportunities today that can take advantage of GOWIN’s product value.  As we grow further in the region, we will leverage the vast talent pool located here and elsewhere to aid in our expansion.”   “I am honored and excited to lead the marketing and sales team enabling growth,” said Scott Casper, Director of Sales, Americas.  “Silicon Valley is an important area for us to start our expansion plans into the North America target markets. With our products, we look forward to participating in the technology advancements here.”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in USA and China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com